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ADG4612/ADG4613
Rev. 0 | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
Rating
VDD to VSS
18 V
VDD to GND
0.3 V to +18 V
VSS to GND
+0.3 V to 7 V
Analog Inputs; VS to VD
18 V
Analog Inputs; VD , VS
7 V to +18 V
Most Negative (VS,VD or VSS) to
Most Positive (VS,VD, Inx, or VDD)
18 V
Digital Inputs, INx
GND 0.3 V to +18 V
Peak Current, Sx or Dx
350 mA (pulsed at 1 ms,
10% duty cycle max)
Continuous Current, Sx or D
x1Data + 15%
Operating Temperature Range
40°C to +105°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Reflow Soldering Peak
Temperature, Pb-free
260 (0/5)°C
1 See
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
THERMAL RESISTANCE
θJA is specified for a 4-layer board and, where applicable, with
the exposed pad soldered to the board.
Table 7. Thermal Resistance
Package Type
θJA
Unit
16-Lead TSSOP
112
°C/W
16-Lead LFCSP
48.7
°C/W
ESD CAUTION