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ADG411/ADG412/ADG413
Rev. D | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameters
Ratings
VDD to VSS
44 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
VL to GND
0.3 V to VDD + 0.3 V
VSS 2 V to VDD + 2 V or
30 mA, whichever
occurs first
Continuous Current, S or D
30 mA
Peak Current, S or D (Pulsed at 1 ms,
10% Duty Cycle max)
100 mA
Operating Temperature Range
Industrial (B Version)
40°C to +85°C
Extended (T Version)
55°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
PDIP, Power Dissipation
470 mW
θJA Thermal Impedance
117°C/W
Lead Temperature, Soldering (10 s)
260°C
SOIC Package, Power Dissipation
600 mW
θJA Thermal Impedance
77°C/W
TSSOP Package, Power Dissipation
450 mW
θJA Thermal Impedance
115°C/W
θJC Thermal Impedance
35°C/W
Lead Temperature, Soldering
Vapor Phase (60 s)
215°C
Infrared (15 s)
220°C
1 Overvoltages at IN, S, or D are clamped by internal diodes. Current should
be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Only one absolute maximum rating may be
applied at any one time.
ESD CAUTION