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參數(shù)資料
| 型號： | ADG3247BRU-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 6/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SW BUS 2.5/3.3V 16BIT 38TSSOP |
| 標準包裝： | 1,000 |
| 類型： | 總線開關 |
| 電路： | 8 x 1:1 |
| 獨立電路： | 2 |
| 電壓電源： | 單電源 |
| 電源電壓： | 2.5V, 3.3V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 38-TFSOP（0.173"，4.40mm 寬） |
| 供應商設備封裝： | 38-TSSOP |
| 包裝： | 帶卷 (TR) |
REV. 0
ADG3247
–3–
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
LFCSP Package
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 32
°C/W
TSSOP Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 98°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300
°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the opera tional
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3247 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Table I. Pin Description
Mnemonic
Description
BEx
Bus Enable (Active Low)
SEL
Level Translation Select
Ax
Port A, Inputs or Outputs
Bx
Port B, Inputs or Outputs
Table II. Truth Table
BEx SEL* Function
LL
A = B, 3.3 V to 1.8 V Level Shifting
LH
A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting
HX
Disconnect
*SEL = 0 only when VDD = 3.3 V
± 10%
PIN CONFIGURATION
40-Lead LFCSP and 38-Lead TSSOP
PIN 1
INDICATOR
TOP VIEW
ADG3247
1
2
3
4
5
6
7
8
9
10
NC = NO CONNECT
GND
11
NC
12
NC
13
NC
14
B15
15
B14
1
6
B13
17
B12
18
B11
19
B10
20
30 B0
29 B1
28 B2
27 B3
26 B4
25 B5
24 B6
23 B7
22 B8
21 B9
40
A5
39
A4
38
A3
37
A2
36
A1
35
A0
33
V
CC
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
34
SEL
32
BE2
31
BE1
TOP VIEW
(Not to Scale)
38
37
36
35
34
33
32
1
2
3
4
5
6
7
A0
A1
A2
A3
A4
A5
VCC
BE1
BE2
SEL
B0
B1
B2
B3
ADG3247
31
30
29
8
9
10
A6
A7
A8
B4
B5
B6
28
27
11
12
A9
A10
A11
A12
A13
A14
A15
B7
B8
26
25
B9
B10
B11
B12
B13
B14
B15
24
23
22
17
21
20
18
19
GND
NC
13
14
15
16
NC = NO CONNECT
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG3247BCP
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-40
ADG3247BCP-REEL7
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-40
ADG3247BRU
–40
°C to +85°CThin Shrink Small Outline Package (TSSOP)
RU-38
ADG3247BRU-REEL7
–40
°C to +85°CThin Shrink Small Outline Package (TSSOP)
RU-38
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