V
參數(shù)資料
型號: ADG2108BCPZ-HS-RL7
廠商: Analog Devices Inc
文件頁數(shù): 2/28頁
文件大?。?/td> 0K
描述: IC CROSSPOINT SWIT 8X10 32LFCSP
產(chǎn)品培訓(xùn)模塊: Switch Fundamentals
產(chǎn)品變化通告: Interface Change Notice 12/Apr/2010
標(biāo)準(zhǔn)包裝: 1
功能: 交叉點(diǎn)開關(guān)
電路: 1 x 8:10
導(dǎo)通狀態(tài)電阻: 50 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 12V,±15V
電流 - 電源: 50nA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 32-LFCSP-VQ(5x5)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: ADG2108BCPZ-HS-RL7DKR
ADG2108
Data Sheet
Rev. B | Page 10 of 28
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NC = NO CONNECT
Y2
Y4
Y3
Y6
Y7
Y1
Y0
Y5
NC
VDD
X9
X8
X7
X6
X5
X4
X1
NC
X3
X2
X0
VSS
R
ESET
A1
S
CL
A2
A0
S
DA
G
ND
V
L
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
9
10
11
13
14
15
16
12
PIN 1
INDICATOR
ADG2108
10 × 8
TOP VIEW
(Not to Scale)
05898-
003
Exposed Paddle Soldered to VSS
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
VSS
Negative Power Supply in a Dual-Supply Application. For single-supply applications, this pin
should be tied to GND.
2 to 4, 23
NC
No Connect.
5 to 8,
17 to 22
X0 to X9
Can be inputs or outputs.
9 to 16
Y0 to Y7
Can be inputs or outputs.
24
VDD
Positive Power Supply Input.
25
VL
Logic Power Supply Input.
26
SDA
Digital I/O. Bidirectional open drain data line. External pull-up resistor required.
27
SCL
Digital Input, Serial Clock Line. Open drain input that is used in conjunction with SDA to clock data
into the device. External pull-up resistor required.
28
A0
Logic Input. Address pin that sets the least significant bit of the 7-bit slave address.
29
A1
Logic Input. Address pin that sets the second least significant bit of the 7-bit slave address.
30
A2
Logic Input. Address pin that sets the third least significant bit of the 7-bit slave address.
31
RESET
Active Low Logic Input. When this pin is low, all switches are open, and appropriate registers are cleared to 0.
32
GND
Ground. Reference point for all circuitry on the ADG2108.
EP
Exposed Pad. It is recommended that the exposed pad be soldered to VSS to improve heat dissipation and
crosstalk.
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