ADG1606/ADG1607
Rev. 0 | Page 8 of 24
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
TA = 25°C, unless otherwise noted.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7.
Parameter
Rating
VDD to VSS
18 V
VDD to GND
0.3 V to +18 V
VSS to GND
+0.3 V to 18 V
VSS 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
GND 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D
1.1 A (pulsed at 1 ms,
10% duty cycle maximum)
Continuous Current, S or
D3Data + 15%
Operating Temperature Range
Industrial (B Version)
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Reflow Soldering Peak
Temperature, Pb Free
260°C
Table 8. Thermal Resistance
Package Type
θJA
θJC
Unit
28-Lead TSSOP
97.9
14
°C/W
32-Lead LFCSP_VQ
46
°C/W
ESD CAUTION
1 Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
2 Overvoltages at the Ax, EN, Sx, or Dx pins are clamped by internal diodes.
Current should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.