ADG1411/ADG1412/ADG1413
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
V
DD to VSS
35 V
V
DD to GND
0.3 V to +25 V
V
SS to GND
+0.3 V to 25 V
V
SS 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
GND 0.3 V to V
DD + 0.3 V or
30 mA, whichever occurs first
Peak Current, Sx or Dx Pins
500 mA (pulsed at 1 ms,
10% duty cycle maximum)
Continuous Current per
Channel at 25°C
16-Lead TSSOP
190 mA
16-Lead LFCSP
250 mA
Continuous Current per
Channel at 125°C
16-Lead TSSOP
90 mA
16-Lead LFCSP
100 mA
Operating Temperature Range
Automotive (Y Version)
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
16-Lead TSSOP, θ
JA Thermal
Impedance (Four-Layer Board)
112°C/W
16-Lead LFCSP, θ
JA Thermal
Impedance
30.4°C/W
Reflow Soldering Peak
Temperature, Pb Free
260(+0/5)°C
1 Overvoltages at the INx, Sx, and Dx pins are clamped by internal diodes.
Current should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
ESD CAUTION