ADG1401/ADG1402
Rev. 0 | Page 7 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to VSS
35 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
VSS 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
GND 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D
(Pulsed at 1 ms, 10%
Duty-Cycle Maximum)
8-Lead MSOP (4-Layer Board)
500 mA
8-Lead LFCSP
700 mA
Continuous Current per
Channel, S or D
Operating Temperature Range
Industrial
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Reflow Soldering Peak
Temperature, Pb Free
260°C
1 Over voltages at IN, S, or D are clamped by internal diodes. Current should
be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead MSOP (4-Layer Board)
206
44
°C/W
8-Lead LFCSP
50.8
°C/W
ESD CAUTION