參數資料
型號: ADCLK925/PCBZ
廠商: Analog Devices Inc
文件頁數: 14/16頁
文件大?。?/td> 0K
描述: BOARD EVAL FOR ADCLK925 16LFCSP
設計資源: ADCLK9xx Eval Brd Schematics
ADCLK9xx Gerber Files
ADCLK925 BOM
標準包裝: 1
主要目的: 計時,時鐘緩沖器 / 驅動器 / 接收器 / 變換器
嵌入式:
已用 IC / 零件: ADCLK925
主要屬性: 1 輸入,2 輸出
次要屬性: ECL,LVPECL,PECL 輸出邏輯
已供物品:
相關產品: ADCLK925BCPZ-R7DKR-ND - IC CLOCK/DATA BUFFER 1:2 16LFCSP
ADCLK925BCPZ-R7CT-ND - IC CLOCK/DATA BUFFER 1:2 16LFCSP
ADCLK925BCPZ-R7TR-ND - IC CLOCK/DATA BUFFER 1:2 16LFCSP
ADCLK925BCPZ-WP-ND - IC CLOCK/DATA BUFFER 1:2 16LFCSP
ADCLK925BCPZ-R2-ND - IC CLOCK/DATA BUFFER 1:2 16LFCSP
ADCLK905/ADCLK907/ADCLK925
Rev. 0 | Page 7 of 16
Pin No.
Mnemonic
Description
10
Q2
Noninverting Output 2.
11
Q1
Inverting Output 1.
12
Q1
Noninverting Output 1.
15
VREF1
Reference Voltage 1. Reference voltage for biasing ac-coupled inputs, Channel 1.
16
VT1
Center Tap 1. Center tap of 100 Ω input resistor, Channel 1.
Heat Sink
NC
No Connect. The metallic back surface of the package is not electrically connected to any part of the circuit.
It can be left floating for optimal electrical isolation between the package handle and the substrate of the die.
It can also be soldered to the application board if improved thermal and/or mechanical stability is desired.
Exposed metal at the corners of the package is connected to this back surface. Allow sufficient clearance
to vias and other components.
PIN 1
INDICATOR
NC = NO CONNECT
1
D
2
D
3
NC
4
NC
11 Q1
12 Q1
10 Q2
9Q2
5
N
C
6
N
C
7
V
E
8
V
C
15
V
R
E
F
16
V
T
14
V
E
13
V
C
ADCLK925
TOP VIEW
(Not to Scale)
06
31
8-
0
06
Figure 6. ADCLK925 Pin Configuration
Table 6. Pin Function Descriptions for 1:2 ADCLK925 Buffer
Pin No.
Mnemonic
Description
1
D
Noninverting Input.
2
D
Inverting Input.
3, 4, 5, 6
NC
No Connect. No physical connection to the die.
7, 14
VEE
Negative Supply Voltage.
8, 13
VCC
Positive Supply Voltage.
9
Q2
Inverting Output 2.
10
Q2
Noninverting Output 2.
11
Q1
Inverting Output 1.
12
Q1
Noninverting Output 1.
15
VREF
Reference Voltage. Reference voltage for biasing ac-coupled inputs.
16
VT
Center Tap. Center tap of 100 Ω input resistor.
Heat Sink
NC
No Connect. The metallic back surface of the package is not electrically connected to any part of the circuit.
It can be left floating for optimal electrical isolation between the package handle and the substrate of the die.
It can also be soldered to the application board if improved thermal and/or mechanical stability is desired.
Exposed metal at the corners of the package is connected to this back surface. Allow sufficient clearance
to vias and other components.
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