
4
ADC774
ABSOLUTE MAXIMUM RATINGS
V
CC
to Digital Common ......................................................... 0V to +16.5V
V
EE
to Digital Common.......................................................... 0V to –16.5V
V
Digital Common .............................................................. 0V to +7V
Analog Common to Digital Common....................................................
±
1V
Control Inputs (CE, CS, A
O
, 12/8, R/C)
to Digital Common .............................................. –0.5V to V
LOGIC
+0.5V
Analog Inputs (Ref In, Bipolar Offset, 10V
)
to Analog Common ......................................................................
±
16.5V
20V
IN
to Analog Common ..................................................................
±
24V
Ref Out.......................................................... Indefinite Short to Common,
Momentary Short to V
CC
Max Junction Temperature ............................................................ +165
°
C
Power Dissipation ........................................................................ 1000mW
Lead Temperature (soldering,10s)................................................. +300
°
C
Thermal Resistance,
θ
JA
: Ceramic ................................................50
°
C/W
Plastic ................................................. 100
°
C/W
CAUTION: These devices are sensitive to electrostatic discharge.
Appropriate I.C. handling procedures should be followed.
BURN-IN SCREENING
Burn-in screening is available for both plastic and ceramic
package ADC774s. Burn-in duration is 160 hours at the
temperature (or equivalent combination of time and tem-
perature) indicated below:
Plastic “-BI” models: +85
°
C
Ceramic “-BI” models: +125
°
C
All units are 100% electrically tested after burn-in is com-
pleted. To order burn-in, add “-BI” to the base model
number (e.g. ADC774KP-BI). See Ordering Information for
pricing.
ORDERING INFORMATION
BURN-IN SCREENING OPTION
See text for details.
LINEARITY
ERROR MAX
(T
MIN
TO T
MAX
)
TEMPERATURE
RANGE
MODEL
PACKAGE
ADC774JP
ADC774KP
ADC774JH
ADC774KH
ADC774SH
ADC774TH
Plastic DIP
Plastic DIP
Ceramic DIP
Ceramic DIP
Ceramic DIP
Ceramic DIP
0
°
C TO +75
°
C
0
°
C to +75
°
C
0
°
C to +75
°
C
0
°
C to +75
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
±
1LSB
±
1/2LSB
±
1LSB
±
1/2LSB
±
1LSB
±
3/4LSB
TEMPERATURE
RANGE
BURN-IN TEMP
(160 HOURS)
(1)
MODEL
PACKAGE
ADC774JP-BI
ADC774KP-BI
ADC774JH-BI
ADC774KH-BI
ADC774SH-BI
ADC774TH-BI
Plastic DIP
Plastic DIP
Ceramic DIP
Ceramic DIP
Ceramic DIP
Ceramic DIP
0
°
C to +75
°
C
0
°
C to +75
°
C
0
°
C to +75
°
C
0
°
C to +75
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
+85
°
C
+85
°
C
+125
°
C
+125
°
C
+125
°
C
+125
°
C
PACKAGE INFORMATION
PACKAGE DRAWING
NUMBER
(1)
MODEL
PACKAGE
ADC774JP
ADC774KP
ADC774JH
ADC774KH
ADC774SH
ADC774TH
ADC774JP-BI
ADC774KP-BI
ADC774JH-BI
ADC774KH-BI
ADC774SH-BI
ADC774TH-BI
28-Pin Plastic DIP
28-Pin Plastic DIP
28-Pin Ceramic DIP
28-Pin Ceramic DIP
28-Pin Ceramic DIP
28-Pin Ceramic DIP
28-Pin Plastic DIP
28-Pin Plastic DIP
28-Pin Ceramic DIP
28-Pin Ceramic DIP
28-Pin Ceramic DIP
28-Pin Ceramic DIP
215
215
149
149
149
149
215
215
149
149
149
149
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.