參數(shù)資料
型號(hào)： ADA4950-1YCPZ-RL
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 16/28頁(yè)
文件大?。?/td> 0K
描述： IC AMP DIFF LP 114MA 16LFCSP
標(biāo)準(zhǔn)包裝： 5,000
放大器類型： 差分
電路數(shù)： 1
輸出類型： 差分
轉(zhuǎn)換速率： 2900 V/µs
-3db帶寬： 750MHz
電壓 - 輸入偏移： 200µV
電流 - 電源： 9.5mA
電流 - 輸出 / 通道： 114mA
電壓 - 電源，單路/雙路(±)： 3 V ~ 11 V，±1.5 V ~ 5.5 V
工作溫度： -40°C ~ 105°C
安裝類型： 表面貼裝
封裝/外殼： 16-VFQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 16-LFCSP-VQ
包裝： 帶卷 (TR)
Data Sheet
ADA4950-1/ADA4950-2
Rev. A | Page 23 of 28
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4950-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design.
The first requirement is a solid ground plane that covers as
much of the board area around the ADA4950-x as possible. The
thermal resistance, θJA, is specified for the device, including the
exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD51-7.
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. Use high frequency
ceramic chip capacitors. It is recommended that two parallel
bypass capacitors (1000 pF and 0.1 μF) be used for each supply.
Place the 1000 pF capacitor closer to the device. Farther away,
provide low frequency bulk bypassing using 10 μF tantalum
capacitors from each supply to ground.
Signal routing should be short and direct to avoid parasitic
effects. Wherever complementary signals exist, provide a
symmetrical layout to maximize balanced performance. When
routing differential signals over a long distance, keep PCB
traces close together, and twist any differential wiring to
minimize loop area. Doing this reduces radiated energy and
makes the circuit less susceptible to interference.
1.30
0.80
1.30
07
95
7-
0
56
Figure 61. Recommended PCB Thermal Attach Pad (Dimensions in Millimeters)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
07
95
7-
05
7
Figure 62. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
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