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參數(shù)資料
| 型號(hào)： | ADA4950-1YCP-EBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 16/28頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR ADA4950-1YCP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 每 IC 通道數(shù)： | 1 - 單 |
| 放大器類型： | 差分 |
| 板類型： | 裸（未填充） |
| 已供物品： | 板 |
| 已用 IC / 零件： | 16-LFCSP 封裝 |
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Data Sheet
ADA4950-1/ADA4950-2
Rev. A | Page 23 of 28
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4950-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design.
The first requirement is a solid ground plane that covers as
much of the board area around the ADA4950-x as possible. The
thermal resistance, θJA, is specified for the device, including the
exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD51-7.
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. Use high frequency
ceramic chip capacitors. It is recommended that two parallel
bypass capacitors (1000 pF and 0.1 μF) be used for each supply.
Place the 1000 pF capacitor closer to the device. Farther away,
provide low frequency bulk bypassing using 10 μF tantalum
capacitors from each supply to ground.
Signal routing should be short and direct to avoid parasitic
effects. Wherever complementary signals exist, provide a
symmetrical layout to maximize balanced performance. When
routing differential signals over a long distance, keep PCB
traces close together, and twist any differential wiring to
minimize loop area. Doing this reduces radiated energy and
makes the circuit less susceptible to interference.
1.30
0.80
1.30
07
95
7-
0
56
Figure 61. Recommended PCB Thermal Attach Pad (Dimensions in Millimeters)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
07
95
7-
05
7
Figure 62. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADA4950-1YCPZ-R2 | 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single ±5.5V/11V 16-Pin LFCSP EP T/R 制造商:Analog Devices 功能描述:FIXED GAIN 1,2&3 DIFF ADC DRIVER - Tape and Reel 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single }5.5V/11V 16-Pin LFCSP EP |
| ADA4950-1YCPZ-R7 | 功能描述:IC AMP DIFF LP 114MA 16LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Differential Circuit Design Techniques for Communication Applications 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:RF/IF 差分 電路數(shù):1 輸出類型:差分 轉(zhuǎn)換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤，CSP 供應(yīng)商設(shè)備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT |
| ADA4950-1YCPZ-RL | 功能描述:IC AMP DIFF LP 114MA 16LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 放大器類型:J-FET 電路數(shù):2 輸出類型:- 轉(zhuǎn)換速率:3.5 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:30pA 電壓 - 輸入偏移:2000µV 電流 - 電源:200µA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):7 V ~ 36 V，±3.5 V ~ 18 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:8-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:8-PDIP 包裝:管件 |
| ADA4950-2 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Power, Selectable Gain Differential ADC Driver, G = 1, 2, 3 |
| ADA4950-2YCP-EBZ | 功能描述:BOARD EVAL FOR ADA4950-2YCP RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估板 - 運(yùn)算放大器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- |
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