參數(shù)資料
型號(hào)： ADA4932-1YCP-EBZ
廠(chǎng)商： Analog Devices Inc
文件頁(yè)數(shù)： 18/29頁(yè)
文件大小： 0K
描述： BOARD EVAL FOR ADA4932-1YCP
標(biāo)準(zhǔn)包裝： 1
每 IC 通道數(shù)： 1 - 單
放大器類(lèi)型： 差分
板類(lèi)型： 裸（未填充）
已供物品： 板
已用 IC / 零件： 16-LFCSP 封裝
ADA4932-1/ADA4932-2
Data Sheet
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4932-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design.
The first requirement is a solid ground plane that covers as much
of the board area around the ADA4932-x as possible. However,
the area near the feedback resistors (RF), gain resistors (RG), and
the input summing nodes (Pin 2 and Pin 3) should be cleared of
all ground and power planes (see Figure 64). Clearing the ground
and power planes minimizes any stray capacitance at these nodes
and thus minimizes peaking of the response of the amplifier at
high frequencies.
The thermal resistance, θJA, is specified for the device, including
the exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD51-7.
07752-
055
Figure 64. Ground and Power Plane Voiding in Vicinity of RF and RG
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. High frequency ceramic
chip capacitors should be used. It is recommended that two
parallel bypass capacitors (1000 pF and 0.1 F) be used for each
supply. Place the 1000 pF capacitor closer to the device. Further
away, provide low frequency bulk bypassing using 10 F tantalum
capacitors from each supply to ground.
Signal routing should be short and direct to avoid parasitic effects.
Wherever complementary signals exist, provide a symmetrical
layout to maximize balanced performance. When routing
differential signals over a long distance, keep PCB traces close
together, and twist any differential wiring to minimize loop
area. Doing this reduces radiated energy and makes the circuit
less susceptible to interference.
1.30
0.80
1.30
07752-
056
Figure 65. Recommended PCB Thermal Attach Pad Dimensions (Millimeters)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
07752-
057
Figure 66. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
Rev. C | Page 24 of 28
相關(guān)PDF資料
PDF描述
ADA4950-1YCP-EBZ BOARD EVAL FOR ADA4950-1YCP
LLS2W221MELC CAP ALUM 220UF 450V 20% SNAP
222D132-4-60/42-0 BOOT MOLDED
ECM18DRKI-S13 CONN EDGECARD 36POS .156 EXTEND
222D132-3-60/42-0 BOOT MOLDED
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADA4932-1YCPZ-R2 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single 制造商:Analog Devices 功能描述:LW CST/LW PWR DIFF ADC DRIVER - Tape and Reel 制造商:Analog Devices 功能描述:ANAADA4932-1YCPZ-R2 LW CST/LW PWR DIFF A 制造商:Analog Devices 功能描述:AMP DIFF LP 80MA 16LFCSP 制造商:Analog Devices 功能描述:AMP, DIFF, LP, 80MA, 16LFCSP 制造商:Analog Devices 功能描述:AMP, DIFF, LP, 80MA, 16LFCSP; No. of Amplifiers:1; Input Offset Voltage:2.2mV; Bandwidth:560MHz; Amplifier Case Style:LFCSP; No. of Pins:16; Supply Voltage Range:3V to 11V; Slew Rate:2800V/s; Supply Current:9.6mA; Operating ;RoHS Compliant: Yes 制造商:Analog Devices 功能描述:SP Amp Diff ADC Driver Single 5.5V/11V
ADA4932-1YCPZ-R2 制造商:Analog Devices 功能描述:IC DIFF AMP 560MHZ 2800V/ LFCSP-16
ADA4932-1YCPZ-R21 制造商:AD 制造商全稱(chēng):Analog Devices 功能描述:Low Power Differential ADC Driver
ADA4932-1YCPZ-R7 功能描述:IC AMP DIFF LP 80MA 16LFCSP RoHS:是 類(lèi)別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Differential Circuit Design Techniques for Communication Applications 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類(lèi)型:RF/IF 差分 電路數(shù):1 輸出類(lèi)型:差分 轉(zhuǎn)換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤(pán)，CSP 供應(yīng)商設(shè)備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產(chǎn)品目錄頁(yè)面:551 (CN2011-ZH PDF) 其它名稱(chēng):ADL5561ACPZ-R7CT
ADA4932-1YCPZ-R71 制造商:AD 制造商全稱(chēng):Analog Devices 功能描述:Low Power Differential ADC Driver
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