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參數(shù)資料
| 型號： | ADA4303-2 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 1:2 Single-Ended, Low Cost Active RF Splitter |
| 中文描述： | 1:2單端，低成本有源RF分路器 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大?。?/td> | 213K |
| 代理商： | ADA4303-2 |
ADA4303-2
ABSOLUTE MAXIMUM RATINGS
Rev. 0 | Page 4 of 12
Table 2.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum
Rating may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions; that is, θ
JA
is
specified for a device (including exposed pad) soldered to
the circuit board.
Rating
5.5 V
See Figure 3
65°C to +125°C
40°C to +85°C
300°C
150°C
Table 3. Thermal Resistance
Package Type
12-Lead LFCSP_VQ (exposed pad)
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4303-2
package is limited by the associated rise in junction
temperature (T
J
) on the die. At approximately 150°C, which
is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature
limit can change the stresses that the package exerts on the
die, permanently shifting the parametric performance of
the ADA4303-2. Exceeding a junction temperature of 150°C
for an extended period can result in changes in the silicon
devices, potentially causing failure.
θ
JA
99.2
Unit
°C/W
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the
voltage between the supply pins (V
S
) times the quiescent
current (I
S
). The power dissipated due to the load drive depends
upon the particular application. The power due to load drive is
calculated by multiplying the load current by the associated
voltage drop across the device. RMS voltages and currents must
be used in these calculations.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package
leads/exposed pad from metal traces, through-holes, ground,
and power planes reduces the θ
JA
.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 12-lead LFCSP_VQ
(99.2°C/W) on a JEDEC standard 4-layer board.
0
–60
–40
–20
M
AMBIENT TEMPERATURE (°C)
0
0.5
1.0
2.0
1.5
2.5
0
20
40
60
80
100
120
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADA4303-2ACPZ-EB | 功能描述:BOARD EVAL FOR ADA4303 RoHS:是 類別:RF/IF 和 RFID >> RF 評估和開發(fā)套件，板 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 類型:GPS 接收器 頻率:1575MHz 適用于相關(guān)產(chǎn)品:- 已供物品:模塊 其它名稱:SER3796 |
| ADA4303-2ACPZ-R2 | 功能描述:IC RF SPLITTER ACTIVE 12-LFCSP RoHS:是 類別:RF/IF 和 RFID >> RF 功率分配器/分線器 系列:- 標(biāo)準(zhǔn)包裝:98 系列:- 插入損耗:- 頻率:40MHz ~ 880MHz 技術(shù)規(guī)格:- 尺寸/尺寸:* 封裝/外殼:- 包裝:管件 |
| ADA4303-2ACPZ-R7 | 功能描述:IC RF SPLITTER ACTIVE 12LFCSP RoHS:是 類別:RF/IF 和 RFID >> RF 功率分配器/分線器 系列:- 標(biāo)準(zhǔn)包裝:98 系列:- 插入損耗:- 頻率:40MHz ~ 880MHz 技術(shù)規(guī)格:- 尺寸/尺寸:* 封裝/外殼:- 包裝:管件 |
| ADA4303-2ACPZ-RL | 功能描述:IC RF SPLITTER ACTIVE 12-LFCSP RoHS:是 類別:RF/IF 和 RFID >> RF 功率分配器/分線器 系列:- 標(biāo)準(zhǔn)包裝:98 系列:- 插入損耗:- 頻率:40MHz ~ 880MHz 技術(shù)規(guī)格:- 尺寸/尺寸:* 封裝/外殼:- 包裝:管件 |
| ADA4304-2 | 制造商:AD 制造商全稱:Analog Devices 功能描述:1:2 Single-Ended, Low Cost, Active RF Splitter |
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