AD9763/AD9765/AD9767
Data Sheet
Rev. G | Page 8 of 44
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
With
Respect To
Rating
AVDD
ACOM
0.3 V to +6.5 V
DVDD1, DVDD2
DCOM1/DCOM2
0.3 V to +6.5 V
ACOM
DCOM1/DCOM2
0.3 V to +0.3 V
AVDD
DVDD1/DVDD2
6.5 V to +6.5 V
MODE,
CLK1/IQCLK,
CLK2/IQRESET,
WRT1/IQWRT,
WRT2/IQSEL
DCOM1/DCOM2
0.3 V to DVDD1/
DVDD2 + 0.3 V
Digital Inputs
DCOM1/DCOM2
0.3 V to DVDD1/
DVDD2 + 0.3 V
IOUTA1/IOUTA2,
IOUTB1/IOUTB2
ACOM
1.0 V to AVDD + 0.3 V
REFIO, FSADJ1,
FSADJ2
ACOM
0.3 V to AVDD + 0.3 V
GAINCTRL, SLEEP
ACOM
0.3 V to AVDD + 0.3 V
Junction
Temperature
150°C
Storage
Temperature
Range
65°C to +150°C
Lead Temperature
(10 sec)
300°C
Table 5. Thermal Resistance
Package Type
θJA
Unit
48-Lead LQFP
91
°C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.