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AD9763/AD9765/AD9767
Data Sheet
Rev. G | Page 8 of 44
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
With
Respect To
Rating
AVDD
ACOM
0.3 V to +6.5 V
DVDD1, DVDD2
DCOM1/DCOM2
0.3 V to +6.5 V
ACOM
DCOM1/DCOM2
0.3 V to +0.3 V
AVDD
DVDD1/DVDD2
6.5 V to +6.5 V
MODE,
CLK1/IQCLK,
CLK2/IQRESET,
WRT1/IQWRT,
WRT2/IQSEL
DCOM1/DCOM2
0.3 V to DVDD1/
DVDD2 + 0.3 V
Digital Inputs
DCOM1/DCOM2
0.3 V to DVDD1/
DVDD2 + 0.3 V
IOUTA1/IOUTA2,
IOUTB1/IOUTB2
ACOM
1.0 V to AVDD + 0.3 V
REFIO, FSADJ1,
FSADJ2
ACOM
0.3 V to AVDD + 0.3 V
GAINCTRL, SLEEP
ACOM
0.3 V to AVDD + 0.3 V
Junction
Temperature
150°C
Storage
Temperature
Range
65°C to +150°C
Lead Temperature
(10 sec)
300°C
Table 5. Thermal Resistance
Package Type
θJA
Unit
48-Lead LQFP
91
°C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.