參數(shù)資料
型號: AD9709ASTZRL
廠商: Analog Devices Inc
文件頁數(shù): 12/32頁
文件大?。?/td> 0K
描述: IC DAC 8BIT DUAL 125MSPS 48LQFP
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 2,000
系列: TxDAC+®
設(shè)置時間: 35ns
位數(shù): 8
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 2
電壓電源: 模擬和數(shù)字
功率耗散(最大): 450mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 48-LQFP
供應(yīng)商設(shè)備封裝: 48-LQFP(7x7)
包裝: 帶卷 (TR)
輸出數(shù)目和類型: 4 電流,單極;4 電流,雙極
采樣率(每秒): 125M
配用: AD9709-EBZ-ND - BOARD EVAL FOR AD9709
AD9709
Rev. B | Page 2 of 32
TABLE OF CONTENTS
REVISION HISTORY
9/09—Rev. A to Rev. B
Changes to Power and Grounding Considerations Section ..... 20
Changes to Schematics Section..................................................... 24
Changes to Evaluation Board Layout Section............................. 30
1/08—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Changed Single Supply Operation to 5 V or 3.3 V ........Universal
Changes to Figure 1.......................................................................... 1
Added Timing Diagram Section .................................................... 5
Changes to Figure 3 and Table 6..................................................... 7
Change to Figure 12 ......................................................................... 9
Changes to Figure 18 to Figure 20................................................ 10
Changes to Functional Description Section ............................... 13
Changes to Reference Operation Section.................................... 13
Changes to Figure 23 and Figure 24............................................. 13
Changes to Gain Control Mode Section...................................... 13
Replaced Reference Control Amplifier Section with Setting
the Full-Scale Current Section...................................................... 13
Changes to DAC Transfer Function Section............................... 14
Changes to Interleaved Mode Timing Section ........................... 16
Added Figure 28 ............................................................................. 16
Changes to Power and Grounding Considerations Section ..... 20
Changes to Figure 44...................................................................... 22
Deleted Figure 43............................................................................ 17
Changes to CDMA Section ........................................................... 23
Changes to Figure 45 Caption ...................................................... 23
Changes to Figure 46...................................................................... 24
Changes to Figure 48...................................................................... 26
Updated Outline Dimensions....................................................... 30
Changes to Ordering Guide .......................................................... 30
5/00—Revision 0: Initial Version
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