參數(shù)資料
型號(hào): AD9204BCPZRL7-20
廠(chǎng)商: Analog Devices Inc
文件頁(yè)數(shù): 30/36頁(yè)
文件大小: 0K
描述: IC ADC 10BIT 20MSPS 64LFCSP
標(biāo)準(zhǔn)包裝: 750
位數(shù): 10
采樣率(每秒): 20M
數(shù)據(jù)接口: 串行,SPI?
轉(zhuǎn)換器數(shù)目: 2
功率耗散(最大): 69.5mW
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 64-VFQFN 裸露焊盤(pán),CSP
供應(yīng)商設(shè)備封裝: 64-LFCSP-VQ(9x9)
包裝: 帶卷 (TR)
輸入數(shù)目和類(lèi)型: 4 個(gè)單端,單極;2 個(gè)差分,單極
AD9204
Rev. 0 | Page 36 of 36
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
09
17
07
-C
6.35
6.20 SQ
6.05
0.25 MIN
TOP VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
EXPOSED PAD
(BOTTOM VIEW)
SEATING
PLANE
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 59. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad (CP-64-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD9204BCPZ-801, 2
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9204BCPZRL7-801, 2
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9204BCPZ-651, 2
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9204BCPZRL7-651, 2
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9204BCPZ-401, 2
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9204BCPZRL7-401, 2
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9204BCPZ-201, 2
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9204BCPZRL7-201, 2
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
1 Z = RoHS Compliant Part.
2 The exposed paddle (Pin 0) is the only GND connection on the chip and must be connected to the PCB AGND.
2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08122-0-7/09(0)
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