參數(shù)資料
型號: AD8663ACPZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 12/16頁
文件大?。?/td> 0K
描述: IC OPAMP GP R-R CMOS LN 8LFCSP
標(biāo)準(zhǔn)包裝: 5,000
系列: DigiTrim®
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.3 V/µs
增益帶寬積: 540kHz
電流 - 輸入偏壓: 0.3pA
電壓 - 輸入偏移: 40µV
電流 - 電源: 230µA
電流 - 輸出 / 通道: 50mA
電壓 - 電源,單路/雙路(±): 5 V ~ 16 V,±2.5 V ~ 8 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-VFDFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 8-LFCSP-VD(3x3)
包裝: 帶卷 (TR)
Data Sheet
AD8663/AD8667/AD8669
Rev. C | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
18 V
Input Voltage
0.1 V to VSY
Differential Input Voltage
18 V
Output Short-Circuit Duration to GND
Indefinite
Storage Temperature Range
60°C to +150°C
Operating Temperature Range
40°C to +125°C
Junction Temperature Range
65°C to +150°C
Lead Temperature, Soldering (60 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead SOIC (R-8)
121
43
°C/W
8-Lead LFCSP (CP-8-2)
751
°C/W
8-Lead MSOP (RM-8)
145
45
°C/W
14-Lead SOIC (R-14)
90
45
°C/W
14-Lead TSSOP (RU-14)
180
35
°C/W
1
Exposed pad soldered to application board.
ESD CAUTION
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