參數(shù)資料
型號(hào): AD8403WARZ50-REEL
廠商: Analog Devices Inc
文件頁(yè)數(shù): 20/32頁(yè)
文件大?。?/td> 0K
描述: IC POT DIG QUAD 50K 8BIT 24SOIC
標(biāo)準(zhǔn)包裝: 1
接片: 256
電阻(歐姆): 50k
電路數(shù): 4
溫度系數(shù): 標(biāo)準(zhǔn)值 500 ppm/°C
存儲(chǔ)器類型: 易失
接口: 4 線 SPI(芯片選擇)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC W
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: AD8403WARZ50-REELDKR
AD8400/AD8402/AD8403
Rev. E | Page 27 of 32
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
06
-A
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
45°
Figure 60. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-14)
Dimensions shown in millimeters and (inches)
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
06
19
08
-A
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 61. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
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