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參數(shù)資料
| 型號(hào)： | AD8398ACPZ-RL |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 7/12頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC LINE DRIVER DUAL VDSL 16LFCSP |
| 標(biāo)準(zhǔn)包裝： | 5,000 |
| 類(lèi)型： | 驅(qū)動(dòng)器 |
| 驅(qū)動(dòng)器/接收器數(shù)： | 2/0 |
| 規(guī)程： | xDSL |
| 電源電壓： | 12V |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 16-VQFN 裸露焊盤(pán)，CSP |
| 供應(yīng)商設(shè)備封裝： | 16-LFCSP-WQ（4x4） |
| 包裝： | 帶卷 (TR) |
AD8398A
Rev. D | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Power Supplies (VCC VEE)
13.2 V
Power Dissipation
(TJ MAX TA)/θJA
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8398A is limited
by its junction temperature (TJ) on the die. The maximum safe
TJ of plastic encapsulated devices, as determined by the glass
transition temperature of the plastic, is 150°C. Temporarily
exceeding this limit may cause a shift in the parametric
performance due to a change in the stresses exerted on the
die by the package. Exceeding this limit for an extended period
can result in device failure.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP_WQ
on a 4-layer board with six vias connecting the exposed pad to
the GND plane layer.
AMBIENT TEMPERATURE (°C)
M
A
X
IM
UM
P
O
W
E
R
DI
S
IP
AT
IO
N
(
W
)
0
5
0
776
0-
0
03
4
3
2
1
TJ = 150°C
6
–40 –30 –20 –10
0
10
20
30
40
50
60
80
70
THERMAL RESISTANCE
θJA is specified with the device soldered on a JEDEC circuit
board and the thermal pad connected to the GND plane layer
using six vias.
Table 3. Thermal Resistance
Package Type
θJA
Unit
16-Lead LFCSP_WQ
35.6
°C/W
Figure 3. Maximum Safe Power Dissipation vs. Ambient Temperature,
4-Layer JEDEC Board with Six Thermal Vias
ESD CAUTION
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