AD7873
Data Sheet
Rev. F | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
+VCC to GND
–0.3 V to +7 V
Analog Input Voltage to GND
–0.3 V to VCC + 0.3 V
Digital Input Voltage to GND
–0.3 V to VCC + 0.3 V
Digital Output Voltage to GND
–0.3 V to VCC + 0.3 V
VREF to GND
–0.3 V to VCC + 0.3 V
Input Current to Any Pin Except Supplie
s1±10 mA
Operating Temperature Range
Commercial (A, B Versions)
–40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150°C
Power Dissipation
450 mW
IR Reflow Soldering
Peak Temperature
220°C (±5°C)
Time-to-Peak Temperature
10 sec to 30 sec
Ramp-Down Rate
6°C/sec max
Pb-free Parts Only
Peak Temperature
250°C
Time-to-Peak Temperature
20 sec to 40 sec
Ramp-Up Rate
3°C/sec max
Ramp-Down Rate
6°C/sec max
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
16-Lead QSOP
149.97
38.8
°C/W
16-Lead TSSOP
150.4
27.6
°C/W
16-Lead LFCSP
135.7
°C/W
ESD CAUTION