TA = 25°C unless otherwise" />
參數(shù)資料
型號: AD7835APZ
廠商: Analog Devices Inc
文件頁數(shù): 26/28頁
文件大小: 0K
描述: IC DAC 14BIT QUAD PARALL 44PLCC
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 1
設(shè)置時(shí)間: 10µs
位數(shù): 14
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 4
電壓電源: 模擬和數(shù)字,雙 ±
功率耗散(最大): 465mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 44-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 44-PLCC(16.59x16.59)
包裝: 管件
輸出數(shù)目和類型: 4 電壓,單極;4 電壓,雙極
采樣率(每秒): 100k
AD7834/AD7835
Rev. D | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. VCC must not exceed VDD by more than
0.3 V. If it is possible for this to happen during power supply sequencing, the diode protection scheme shown in Figure 5 can be used to
provide protection.
Table 5.
AD7834/
AD7835
VDD
VCC
IN4148
SD103C
VDD
VCC
01006-005
Parameter
Rating
VCC to DGND
0.3 V to +7 V, or VDD + 0.3 V
(whichever is lower)
VDD to AGND
0.3 V to +17 V
VSS to AGND
+0.3 V to –17 V
Figure 5. Diode Protection
AGND to DGND
0.3 V to +0.3 V
0.3 V to VCC + 0.3 V
Digital Inputs to DGND
THERMAL RESISTANCE
VREF(+) to VREF(–)
0.3 V to +18 V
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
VREF(+) to AGND
VSS – 0.3 V to VDD + 0.3 V
VREF(–) to AGND
VSS – 0.3 V to VDD + 0.3 V
DSG to AGND
Table 6. Thermal Resistance
VOUT (1–4) to AGND
VSS – 0.3 V to VDD + 0.3 V
Package Type
θJA
Unit
Operating Temperature Range, TA
PDIP
75
°C/W
40°C to +85°C
Industrial (A Version)
SOIC
75
°C/W
65°C to +150°C
Storage Temperature Range
MQFP
95
°C/W
150°C
Junction Temperature, TJ (max)
PLCC
55
°C/W
Power Dissipation, PD (max)
(TJ TA)/θJA
Lead Temperature
JEDEC Industry Standard
ESD CAUTION
Soldering
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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