
AD7816/AD7817/AD7818
–6–
REV. B
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7816/AD7817/AD7818 feature proprietary ESD protection circuitry, perma-
nent damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1
(T
A = 25
°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to AGND
VIN1 to VIN4 . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Reference Input Voltage to AGND
2
. . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120°C/W
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . 260
°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 100
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
8-Lead SOIC Package, Power Dissipation . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
ORDERING GUIDE
Temperature
Package
Branding
Package
Model
Range
Error @ +25
°C
Description
Information
Options
AD7816AR
–55
°C to +125°C
±2°C
8-Lead Narrow Body (SOIC)
SO-8
AD7816ARM
–55
°C to +125°C
±2°C
8-Lead
SOIC
C4A
RM-8
AD7817AR
–40
°C to +85°C
±2°C
16-Lead Narrow Body (SOIC)
R-16A
AD7817BR
–40
°C to +85°C
±1°C
16-Lead Narrow Body (SOIC)
R-16A
AD7817ARU
–40
°C to +85°C
±2°C
16-Lead (TSSOP)
RU-16
AD7817BRU
–40
°C to +85°C
±1°C
16-Lead (TSSOP)
RU-16
AD7817SR
–55
°C to +125°C
±2°C
16-Lead Narrow Body (SOIC)
R-16A
AD7818AR
–55
°C to +125°C
±2°C
8-Lead Narrow Body (SOIC)
SO-8
AD7818ARM
–55
°C to +125°C
±2°C
8-Lead
SOIC
C3A
RM-8
SOIC Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 206
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2If the Reference Input Voltage is likely to exceed V
DD by more than 0.3 V (e.g.,
during power-up) and the reference is capable of supplying 30 mA or more, it is
recommended to use a clamping diode between the REFIN pin and VDD pin. The
diagram below shows how the diode should be connected.
REFIN
VDD
BAT81
AD7816/AD7817
WARNING!
ESD SENSITIVE DEVICE