
AD7816/AD7817/AD7818
–6–
REV. 0
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the
AD7816/AD7817/AD7818
feature proprietary ESD protection circuitry, perma-
nent damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1
(
T
A
= +25
°
C unless otherwise noted)
V
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +7V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +7V
Analog Input Voltage to AGND
VIN1 to VIN4 . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Reference Input Voltage to AGND
2
. . . –0.3 V to V
DD
+ 0.3V
Digital Input Voltage to DGND . . . . . . –0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to DGND . . . . . –0.3 V to V
DD
+ 0.3 V
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120
°
C/W
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . +260
°
C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
8-Lead SOIC Package, Power Dissipation . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
ORDERING GUIDE
Temperature
Range
Temperature
Error @ +25
°
C
Package
Description
Branding
Information
Package
Options
Model
AD7816AR
AD7816ARM
AD7817AR
AD7817BR
AD7817ARU
AD7817BRU
AD7817SR
AD7818AR
AD7818ARM
–55
°
C to +125
°
C
–55
°
C to +125
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
±
2
°
C
±
2
°
C
±
2
°
C
±
1
°
C
±
2
°
C
±
1
°
C
±
2
°
C
±
2
°
C
±
2
°
C
8-Lead Narrow Body (SOIC)
8-Lead
μ
SOIC
16-Lead Narrow Body (SOIC)
16-Lead Narrow Body (SOIC)
16-Lead (TSSOP)
16-Lead (TSSOP)
16-Lead Narrow Body (SOIC)
8-Lead Narrow Body (SOIC)
8-Lead
μ
SOIC
SO-8
RM-8
R-16A
R-16A
RU-16
RU-16
R-16A
SO-8
RM-8
C4A
C3A
μ
SOIC Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2
If the Reference Input Voltage is likely to exceed V
DD
by more than 0.3 V (e.g.,
during power-up) and the reference is capable of supplying 30 mA or more, it is
recommended to use a clamping diode between the REF
IN
pin and V
DD
pin. The
diagram below shows how the diode should be connected.
REF
IN
V
DD
BAT81
AD7816/AD7817
WARNING!
ESD SENSITIVE DEVICE