參數(shù)資料
型號(hào)： AD7816-7818
廠商： Analog Devices, Inc.
元件分類： 溫度/濕度傳感器
英文描述： Single- and 4-Channel, 9 us, 10-Bit ADCs with On-Chip Temperature Sensor
中文描述： 與單核和4通道，9我們，10位ADC片上溫度傳感器
文件頁(yè)數(shù)： 6/20頁(yè)
文件大?。?/td> 279K
代理商： AD7816-7818
REV. C
–6–
AD7816/AD7817/AD7818
ABSOLUTE MAXIMUM RATINGS
1
(
T
A
= 25
°
C unless otherwise noted)
V
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to AGND
V
IN1
to V
IN4
. . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Reference Input Voltage to AGND
2
. . . –0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . . . –0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to DGND . . . . . –0.3 V to V
DD
+ 0.3 V
Storage Temperature Range . . . . . . . . . . . . .–65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120
°
C/W
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . 260
°
C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
8-Lead SOIC Package, Power Dissipation . . . . . . . . . .450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
μ
SOIC Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2
If the Reference Input Voltage is likely to exceed V
by more than 0.3 V (e.g.,
during power-up) and the reference is capable of supplying 30 mA or more, it is
recommended to use a clamping diode between the REF
IN
pin and V
DD
pin. The
diagram below shows how the diode should be connected.
REF
IN
V
DD
BAT81
AD7816/AD7817
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