
AD7741/42
Prelim J1 7/98
5
Preliminary Technical Data
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumu-
late on the human body and test equipment and can discharge without detection. Although these
devices feature proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise noted)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +7 V
Analog Input Voltage to GND . . . . . . . . . . . . . . -5 V to +7V
Reference Input Voltage to GND . . . . . -0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to GND . . . . . . . -0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . -40°C to +85°C
Automotive (Y Version) . . . . . . . . . . . . . -40°C to +105°C
Storage Temperature Range . . . . . . . . . . -65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package
Power Dissipation (8-pin DIP) . . . . . . . . . . . . . . . 520 mW
Power Dissipation (16-pin DIP) . . . . . . . . . . . . . . . 550 mW
θ
JA
Thermal Impedance (8-pin DIP) . . . . . . . . . . . 125°C/W
θ
JA
Thermal Impedance (16-pin DIP) . . . . . . . . . . 117°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . +260°C
PIN CONFIGURATION
DIP and SOIC
AD7741/42 ORDERING GUIDE
Model
Temperature
Range
Package
Option*
AD7741BN
AD7741YR
AD7742BN
AD7742YR
-40°C to +85°C
-40°C to + 105°C
-40°C to +85°C
-40°C to + 105°C
N-8
R-8
N-16
R-16A
*N = Plastic DIP, R = Small Outline IC (SOIC).
16
2
3
4
5
6
7
8
1
15
14
13
12
11
10
9
AD7742
TO P VIEW
(NO T TO S CA LE )
8
2
3
4
1
7
6
5
AD7741
TOP VIE W
(NOT TO S CALE )
SOIC Package
Power Dissipation (8-Lead) . . . . . . . . . . . . . . . . . 290 mW
Power Dissipation (16-Lead) . . . . . . . . . . . . . . . . . 360 mW
θ
JA
Thermal Impedance (8-Lead) . . . . . . . . . . . . . 157°C/W
θ
JA
Thermal Impedance (16-Lead) . . . . . . . . . . . . 125°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.