參數(shù)資料
型號: AD7714*
廠商: Analog Devices, Inc.
英文描述: 3 V/5 V. CMOS. 500 uA Signal Conditioning ADC
中文描述: 3 V / 5號五的CMOS。 500微安ADC的信號調(diào)理
文件頁數(shù): 40/40頁
文件大?。?/td> 306K
AD7714
REV. C
–40–
P
C
OUTLINE DIMENSIONS
Dimensions are shown in inches and (mm).
24-Lead Plastic DIP
(N-24)
24
1
12
13
0.260 ± 0.001
(6.61 ± 0.03)
PIN 1
1.228 (31.19)
1.226 (31.14)
0.11 (2.79)
0.016 (2.28)
SEATING
PLANE
0.02 (0.5)
0.019 (0.41)
0.130 (3.30)
0.128 (7.62)
0.07 (1.78)
0.05 (1.27)
0.32 (8.128)
0.30 (7.62)
0.011 (0.28)
0.009 (0.23)
15
8
0
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Wide Body SOIC
(R-24)
24
13
12
1
0.608 (15.45)
0.596 (15.13)
0.414 (10.52)
0.398 (10.10)
0.299 (7.6)
0.291 (7.39)
PIN 1
SEATING
PLANE
0.01 (0.254)
0.006 (0.15)
0.019 (0.49)
0.014 (0.35)
0.096 (204)
0.089 (2.26)
0.05 (1.27)
BSC
0.013 (0.32)
0.009 (0.23)
0.0500 (1.27)
0.0157 (0.40)
8
8
0
8
0.03 (0.76)
0.02 (0.51)
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
28-Lead Shrink Small Outline Package SSOP
(RS-28)
0.009 (0.229)
0.005 (0.127)
0.03 (0.762)
0.022 (0.558)
8
8
0
8
0.008 (0.203)
0.002 (0.050)
0.07 (1.79)
0.066 (1.67)
SEATING
PLANE
0.0256 (0.65)
BSC
0.311 (7.9)
0.301 (7.64)
0.212 (5.38)
0.205 (5.207)
28
15
14
1
0.407 (10.34)
0.397 (10.08)
PIN 1
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Thin Shrink Small Outline Package TSSOP
(RU-24)
24
13
12
1
0.311 (7.90)
0.303 (7.70)
0
0
0
0
PIN 1
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
0.0433
(1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8
8
0
8
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