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參數(shù)資料
| 型號(hào)： | AD7690 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 16-Bit, +/-0.65 LSB INL, 500 kSPS PulSAR Differential ADC in MSOP/QFN |
| 中文描述： | 16位/ -0.65 LSB INL和500 kSPS的PulSAR系列差分ADC，采用MSOP / QFN封裝 |
| 文件頁數(shù)： | 23/24頁 |
| 文件大?。?/td> | 449K |
| 代理商： | AD7690 |
Preliminary Technical Data
AD7693
APPLICATION HINTS
LAYOUT
The printed circuit board that houses the AD7693 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. The pinout of the
AD7693, with all its analog signals on the left side and all its
digital signals on the right side, eases this task.
Rev. PrB | Page 23 of 24
-
Avoid running digital lines under the device because these
couple noise onto the die unless a ground plane under the
AD7693 is used as a shield. Fast switching signals, such as CNV
or clocks, should not run near analog signal paths. Crossover of
digital and analog signals should be avoided.
At least one ground plane should be used. It could be common
or split between the digital and analog sections. In the latter
case, the planes should be joined underneath the AD7693s.
Figure 45. Example Layout of the AD7693 (Top Layer)
-
The AD7693 voltage reference input REF has a dynamic input
impedance and should be decoupled with minimal parasitic
inductances. This is done by placing the reference decoupling
ceramic capacitor close to, ideally right up against, the REF and
GND pins and connecting them with wide, low impedance traces.
Finally, the power supplies VDD and VIO of the AD7693
should be decoupled with ceramic capacitors, typically 100 nF,
placed close to the AD7693 and connected using short and wide
traces to provide low impedance paths and reduce the effect of
glitches on the power supply lines.
An example of a layout following these rules is shown in
Figure 45 and Figure 46.
EVALUATING THE AD7693’S PERFORMANCE
Other recommended layouts for the AD7693 are outlined
in the documentation of the evaluation board for the AD7693
(
EVAL-AD7693-CB
). The evaluation board package includes
a fully assembled and tested evaluation board, documentation,
and software for controlling the board from a PC via the
EVAL-CONTROL BRD3
.
Figure 46. Example Layout of the AD7693 (Bottom Layer)
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| AD76901 | 制造商:AD 制造商全稱:Analog Devices 功能描述:14-Bit, 500 kSPS PulSAR ADC in MSOP |
| AD7690BCPZ-R2 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
| AD7690BCPZRL | 功能描述:IC ADC 18BIT 400KSPS 10-LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:PulSAR® 標(biāo)準(zhǔn)包裝:1 系列:- 位數(shù):14 采樣率（每秒）:83k 數(shù)據(jù)接口:串行，并聯(lián) 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:95mW 電壓電源:雙 ± 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:28-DIP（0.600"，15.24mm） 供應(yīng)商設(shè)備封裝:28-PDIP 包裝:管件 輸入數(shù)目和類型:1 個(gè)單端，雙極 |
| AD7690BCPZRL7 | 功能描述:IC ADC 18BIT 400KSPS 10-LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:PulSAR® 其它有關(guān)文件:TSA1204 View All Specifications 標(biāo)準(zhǔn)包裝:1 系列:- 位數(shù):12 采樣率（每秒）:20M 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:2 功率耗散（最大）:155mW 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應(yīng)商設(shè)備封裝:48-TQFP（7x7） 包裝:Digi-Reel® 輸入數(shù)目和類型:4 個(gè)單端，單極；2 個(gè)差分，單極 產(chǎn)品目錄頁面:1156 (CN2011-ZH PDF) 其它名稱:497-5435-6 |
| AD7690BRMZ | 功能描述:IC ADC 18BIT 400KSPS 10MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:PulSAR® 標(biāo)準(zhǔn)包裝:1 系列:microPOWER™ 位數(shù):8 采樣率（每秒）:1M 數(shù)據(jù)接口:串行，SPI? 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:- 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-VQFN 裸露焊盤（4x4） 包裝:Digi-Reel® 輸入數(shù)目和類型:8 個(gè)單端，單極 產(chǎn)品目錄頁面:892 (CN2011-ZH PDF) 其它名稱:296-25851-6 |
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