AD7656/AD7657/AD7658
Data Sheet
Rev. D | Page 10 of 32
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to AGND, DGND
0.3 V to +16.5 V
VSS to AGND, DGND
+0.3 V to 16.5 V
VDD to AVCC
AVCC 0.3 V to 16.5 V
AVCC to AGND, DGND
0.3 V to +7 V
DVCC to AVCC
0.3 V to AVCC + 0.3 V
DVCC to DGND, AGND
0.3 V to +7 V
AGND to DGND
0.3 V to +0.3 V
VDRIVE to DGND
0.3 V to DVCC + 0.3 V
Analog Input Voltage to AGN
D1VSS 0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND
0.3 V to VDRIVE + 0.3 V
Digital Output Voltage to GND
0.3 V to VDRIVE + 0.3 V
REFIN to AGND
0.3 V to AVCC + 0.3 V
Input Current to Any Pin Except
±10 mA
Operating Temperature Range
B Version
40°C to +85°C
Y Version
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Pb/SN Temperature, Soldering
Reflow (10 sec to 30 sec)
240(+0)°C
Pb-Free Temperature, Soldering Reflow
260(+0)°C
1
If the analog inputs are being driven from alternative VDD and VSS supply
circuitry, a 240 series resistor should be placed on the analog inputs.
2
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a four-layer board.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
64-Lead LQFP
45
11
°C/W
ESD CAUTION