AD7492
Rev. A | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Ratings
AVDD to AGND/DGND
0.3 V to +7 V
DVDD to AGND/DGND
0.3 V to +7 V
VDRIVE to AGND/DGND
0.3 V to +7 V
AVDD to DVDD
0.3 V to +0.3 V
VDRIVE to DVDD
0.3 V to DVDD + 0.3 V
AGND to DGND
0.3 V to +0.3 V
Analog Input Voltage to AGND
0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND
0.3 V to DVDD + 0.3 V
Input C
urrent to Any Pin Except
±10 mA
Operating Temperature Range
Commercial (A and B Versions)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
SOIC, TSSOP Package Dissipation
450 mW
θJA Thermal Impedance
75°C/W (SOIC)
115°C/W (TSSOP)
θJC Thermal Impedance
25°C/W (SOIC)
35°C/W (TSSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.