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REV. 0
AD7492
–5–
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25
°
C unless otherwise noted)
AV
DD
to AGND/DGND . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DV
DD
to AGND/DGND . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
DRIVE
to AGND/DGND . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +0.3 V
V
DRIVE
to DV
DD
. . . . . . . . . . . . . . . . –0.3 V to DVDD + 0.3 V
AGND TO DGND . . . . . . . . . . . . . . . . . . . .–0.3 V to +0.3 V
Analog Input Voltage to AGND . . . –0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND . . . –0.3 V to DVDD + 0.3 V
Input Current to Any Pin Except Supplies
2
Operating Temperature Range
Commercial (A and B Versions) . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
SOIC, TSSOP Package Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 75
°
C/W (SOIC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
°
C/W (TSSOP)
θ
JC
Thermal Impedance . . . . . . . . . . . . . . . 25
°
C/W (SOIC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
°
C/W (TSSOP)
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
. . . . . . .
±
10 mA
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
ORDERING GUIDE
Temperature
Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Resolution
(Bits)
Throughput Rate
(MSPS)
Package
Description
Package
Option
1
Model
AD7492AR
AD7492ARU
AD7492BR
AD7492BRU
AD7492AR-5
AD7492ARU-5
AD7492BR-5
AD7492BRU-5
EVAL-AD7492CB
2
EVAL-CONTROL BRD2
3
12
12
12
12
12
12
12
12
1
1
1
1
1.25
1.25
1.25
1.25
SOIC
TSSOP
SOIC
TSSOP
SOIC
TSSOP
SOIC
TSSOP
R-24
RU-24
R-24
RU-24
R-24
RU-24
R-24
RU-24
Evaluation Board
Controller Board
NOTES
1
R = SOIC; RU = TSSOP.
2
This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRD2 for evaluation/demonstration purposes.
3
This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators.
PIN CONFIGURATION
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
AD7492
DB9
DB8
DB10
DB7
(MSB) DB11
DB6
AV
DD
V
DRIVE
DV
DD
DGND
REF OUT
V
IN
AGND
DB5
CS
DB4
RD
DB3
CONVST
DB2
PS/
FS
DB1
BUSY
DB0 (LSB)
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7492 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE