
AD7398/AD7399
Rev. C | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VDD to GND
0.3 V, +7 V
VSS to GND
+0.3 V, 7 V
VREF to GND
VSS, VDD
Logic Inputs to GND
0.3 V, +8 V
VOUT to GND
VSS 0.3 V, VDD + 0.3 V
IOUT Short Circuit to GND
50 mA
Thermal Resistance (θJA)
16-Lead SOIC_W Package
(RW-16)
158°C/W
16-Lead TSSOP Package
(RU-16)
180°C/W
Maximum Junction
Temperature (TJ Max)
150°C
Package Power Dissipation
(TJ Max – TA)/θJA
Operating Temperature Range
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Reflow Soldering Peak
Temperature
SnPb
240°C
Pb-Free
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION