參數(shù)資料
型號: AD7304BRUZ
廠商: Analog Devices Inc
文件頁數(shù): 10/20頁
文件大?。?/td> 0K
描述: IC DAC 8BIT QUAD R-R 16-TSSOP
產(chǎn)品培訓模塊: Data Converter Fundamentals
DAC Architectures
標準包裝: 96
設(shè)置時間: 1µs
位數(shù): 8
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 4
電壓電源: 雙 ±
功率耗散(最大): 60mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 16-TSSOP
包裝: 管件
輸出數(shù)目和類型: 4 電壓,單極;4 電壓,雙極
采樣率(每秒): 1M
AD7304/AD7305
Rev. C | Page 18 of 20
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AA
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
16
9
8
1
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
10.50 (0.4134)
10.10 (0.3976)
0.75 (0.0295)
0.25 (0.0098)
× 45°
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COPLANARITY
0.10
Figure 39. 16-Lead Standard Small Outline Package [SOIC]
Wide Body (R-16)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AC
0.75 (0.0295)
0.25 (0.0098)
20
11
10
1
× 45°
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
0.33 (0.0130)
0.20 (0.0079)
1.27
(0.0500)
BSC
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
13.00 (0.5118)
12.60 (0.4961)
COPLANARITY
0.10
Figure 40. 20-Lead Standard Small Outline Package [SOIC]
Wide Body (R-20)
Dimensions shown in millimeters and (inches)
16
9
8
1
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB
Figure 41. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153AC
COPLANARITY
0.10
Figure 42. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
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