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| 型號： | AD7224KP |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 4/8頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 8BIT W/AMP 20-PLCC |
| 產(chǎn)品培訓模塊： | Data Converter Fundamentals DAC Architectures |
| 產(chǎn)品變化通告： | Product Discontinuance 27/Oct/2011 |
| 標準包裝： | 49 |
| 設置時間： | 7µs |
| 位數(shù)： | 8 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 雙 ± |
| 功率耗散（最大）： | 75mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-LCC（J 形引線） |
| 供應商設備封裝： | 20-PLCC（9x9） |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 1 電壓，單極；1 電壓，雙極 |
| 采樣率（每秒）： | 143k |
AD7224
REV. B
–4–
ABSOLUTE MAXIMUM RATINGS
1
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +24 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD
Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD + 0.3 V
VREF to AGND . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
VOUT to AGND
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD
Power Dissipation (Any Package) to +75
°C . . . . . . . . 450 mW
Derates above 75
°C by . . . . . . . . . . . . . . . . . . . . . 6 mW/°C
Operating Temperature
Commercial (K, L Versions) . . . . . . . . . . . –40
°C to +85°C
Industrial (B, C Versions) . . . . . . . . . . . . . –40
°C to +85°C
Extended (T, U Versions) . . . . . . . . . . . . –55
°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300
°C
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2The outputs may be shorted to AGND provided that the power dissipation of the
package is not exceeded. Typically short circuit current to AGND is 60 mA.
ORDERING GUIDE
Total
Temperature
Unadjusted
Package
Model
1
Range
Error (LSB)
Option
2
AD7224KN
–40
°C to +85°C
±2 max
N-18
AD7224LN
–40
°C to +85°C
±1 max
N-18
AD7224KP
–40
°C to +85°C
±2 max
P-20A
AD7224LP
–40
°C to +85°C
±1 max
P-20A
AD7224KR-1
–40
°C to +85°C
±2 max
R-20
AD7224LR-1
–40
°C to +85°C
±1 max
R-20
AD7224KR-18
–40
°C to +85°C
±2 max
R-18
AD7224LR-18
–40
°C to +85°C
±1 max
R-18
AD7224BQ
–40
°C to +85°C
±2 max
Q-18
AD7224CQ
–40
°C to +85°C
±1 max
Q-18
AD7224TQ
–55
°C to +125°C ±2 max
Q-18
AD7224UQ
–55
°C to +125°C ±1 max
Q-18
AD7224TE
–55
°C to +125°C ±2 max
E-20A
AD7224UE
–55
°C to +125°C ±1 max
E-20A
NOTES
1To order MIL-STD-883 processed parts, add /883B to part number.
Contact your local sales office for military data sheet.
2E = Leadless Ceramic Chip Carrier; N = Plastic DIP;
P = Plastic Leaded Chip Carrier; Q = Cerdip; R = SOIC.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7224 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATIONS
DIP and SOIC
(SOIC)
VSS
VOUT
VDD
RESET
DGND
(MSB) DB7
DB6
DB0 (LSB)
DB1
VREF
AGND
LDAC
DB5
DB2
DB4
DB3
CS
WR
1
2
18
17
5
6
7
14
13
12
3
4
16
15
811
910
TOP VIEW
(Not to Scale)
AD7224
VSS
VOUT
VDD
RESET
DGND
(MSB) DB7
DB6
DB0 (LSB)
DB1
VREF
AGND
LDAC
DB5
DB2
DB4
DB3
CS
WR
1
2
18
17
5
6
7
14
13
12
3
4
16
15
811
9
10
TOP VIEW
(Not to Scale)
AD7224
R-18
NC = NO CONNECT
VSS
VOUT
VDD
RESET
DGND
(MSB) DB7
DB6
CS
DB0 (LSB)
DB1
VREF
AGND
LDAC
WR
DB5
DB2
DB4
DB3
NC
1
2
20
19
5
6
7
16
15
14
3
4
18
17
8
13
9
12
10
11
TOP VIEW
(Not to Scale)
AD7224
R-20
LCCC
PLCC
NC = NO CONNECT
VREF
AGND
DB6
DGND
(MSB) DB7
V
OUT
V
SS
RESET
NC
V
DD
DB5
DB4
DB2
NC
DB3
LDAC
WR
DB1
CS
DB0 (LSB)
19
3
1
220
4
5
8
6
7
12 13
911
10
18
17
14
16
15
TOP VIEW
(Not to Scale)
AD7224
NC = NO CONNECT
VREF
AGND
DB6
DGND
(MSB) DB7
V
OUT
V
SS
RESET
NC
V
DD
DB5
DB4
DB2
NC
DB3
LDAC
WR
DB1
CS
DB0 (LSB)
19
31
2
20
4
5
8
6
7
12
13
9
11
10
18
17
14
16
15
TOP VIEW
(Not to Scale)
AD7224
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| AD7224KPZ | 功能描述:IC DAC 8BIT W/OUTPUT AMPS 20PLCC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標準包裝:47 系列:- 設置時間:2µs 位數(shù):14 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應商設備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:* |
| AD7224KR-1 | 功能描述:IC DAC 8BIT W/AMP 20-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標準包裝:47 系列:- 設置時間:2µs 位數(shù):14 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應商設備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:* |
| AD7224KR-18 | 功能描述:IC DAC 8BIT W/AMP 18-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標準包裝:47 系列:- 設置時間:2µs 位數(shù):14 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應商設備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:* |
| AD7224KR-18-MOOG | 制造商:Analog Devices 功能描述: |
| AD7224KR18REEL | 制造商:ANALOG DEVICE 功能描述:DAC 1-CH 18 PIN SOIC |
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