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參數(shù)資料
| 型號： | AD669BQ |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | DAC |
| 英文描述： | Monolithic 16-Bit DACPORT |
| 中文描述： | PARALLEL, WORD INPUT LOADING, 10 us SETTLING TIME, 16-BIT DAC, CDIP28 |
| 封裝： | CERDIP-28 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大?。?/td> | 460K |
| 代理商： | AD669BQ |
AD669
REV. A
–4–
ORDERING GUIDE
Linearity
Error Max
T
MIN
–T
MAX
Gain
TC max
ppm/
8
C
Temperature
Range
Package
Description
Package
Option*
Model
AD669AN
AD669AR
AD669BN
AD669BR
AD669AQ
AD669BQ
AD669SQ
AD669/883B**
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
±
4 LSB
±
4 LSB
±
2 LSB
±
2 LSB
±
4 LSB
±
2 LSB
±
4 LSB
**
25
25
15
15
15
15
15
**
Plastic DIP
SOIC
Plastic DIP
SOIC
Cerdip
Cerdip
Cerdip
**
N-28
R-28
N-28
R-28
Q-28
Q-28
Q-28
**
*
*N = Plastic DIP; Q = Cerdip; R = SOIC.
**Refer to AD669/883B military data sheet.
ESD SENSITIVITY
The AD669 features input protection circuitry consisting of large transistors and polysilicon series
resistors to dissipate both high-energy discharges (Human Body Model) and fast, low-energy pulses
(Charged Device Model). Per Method 3015.2 of MIL-STD-883: C, the AD669 has been classified
as a Class 2 device.
Proper ESD precautions are strongly recommended to avoid functional damage or performance
degradation. Charges as high as 4000 volts readily accumulate on the human body and test
equipment and discharge without detection. Unused devices must be stored in conductive foam or
shunts, and the foam should be discharged to the destination socket before devices are removed.
For further information on ESD precautions, refer to Analog Devices’ ESD Prevention Manual.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
*
V
CC
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +17.0 V
V
EE
to AGND . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –17.0 V
V
LL
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
1 V
Digital Inputs (Pins 5 through 23) to DGND . . . . . . –1.0 V to
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
+7.0 V
REF IN to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
10.5 V
Span/Bipolar Offset to AGND . . . . . . . . . . . . . . . . . . .
±
10.5 V
REF OUT, V
OUT
. . . . . . Indefinite Short To AGND, DGND,
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V
CC
, V
EE
, and V
LL
Power Dissipation (Any Package)
To +60
°
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1000 mW
Derates above +60
°
C . . . . . . . . . . . . . . . . . . . . . .8.7 mW/
°
C
Storage Temperature . . . . . . . . . . . . . . . . . . .–65
°
C to +150
°
C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300
°
C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions above those indicated in
the operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PIN CONFIGURATION
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
DGND
V
EE
V
CC
V
LL
CS
L1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
TOP VIEW
(Not to Scale)
DB7
DB6
DB5
DB4
DB3
DB2
AGND
LDAC
DB0
DB1
AD669
REF OUT
REF IN
V
OUT
SPAN/BIP
OFFSET
T
TEMPERATURE –
°
C
10
0.001
125
0.01
–25
–50
0.1
1
100
75
50
25
0
–60dB
–20dB
0dB
THD+N vs. Temperature
FREQUENCY – Hz
T
10
0.001
0.01
0.1
1
100
10000
1000
–60dB
–20dB
0dB
THD+N vs. Frequency
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AD669BR | Monolithic 16-Bit DACPORT |
| AD669SQ | Monolithic 16-Bit DACPORT |
| AD669 | Monolithic 16-Bit DACPORT |
| AD670AD | Low Cost Signal Conditioning 8-Bit ADC |
| AD670BD | Low Cost Signal Conditioning 8-Bit ADC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD669BR | 功能描述:IC DAC 16BIT MONO W/VREF 28-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:DACPORT® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1,000 系列:- 設(shè)置時間:1µs 位數(shù):8 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:8 電壓電源:雙 ± 功率耗散（最大）:941mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
| AD669BR-REEL | 功能描述:IC DAC 16BIT MONO VREF 28-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:DACPORT® 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals DAC Architectures 標(biāo)準(zhǔn)包裝:750 系列:- 設(shè)置時間:7µs 位數(shù):16 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:雙 ± 功率耗散（最大）:100mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-LCC（J 形引線） 供應(yīng)商設(shè)備封裝:28-PLCC（11.51x11.51） 包裝:帶卷 (TR) 輸出數(shù)目和類型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:143k |
| AD669BRZ | 功能描述:IC DAC 16BIT MONO W/VREF 28-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:DACPORT® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 設(shè)置時間:4µs 位數(shù):12 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-uMAX 包裝:管件 輸出數(shù)目和類型:2 電壓，單極 采樣率（每秒）:* 產(chǎn)品目錄頁面:1398 (CN2011-ZH PDF) |
| AD669BRZ-REEL | 功能描述:IC DAC 16BIT MONO VREF 28-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:DACPORT® 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals DAC Architectures 標(biāo)準(zhǔn)包裝:750 系列:- 設(shè)置時間:7µs 位數(shù):16 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:雙 ± 功率耗散（最大）:100mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-LCC（J 形引線） 供應(yīng)商設(shè)備封裝:28-PLCC（11.51x11.51） 包裝:帶卷 (TR) 輸出數(shù)目和類型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:143k |
| AD669SQ | 功能描述:數(shù)模轉(zhuǎn)換器- DAC IC MONO 16-BIT RoHS:否 制造商:Analog Devices 轉(zhuǎn)換器數(shù)量:4 DAC 輸出端數(shù)量:4 轉(zhuǎn)換速率: 分辨率:12 bit 接口類型:Serial (I2C) 穩(wěn)定時間: 最大工作溫度:+ 105 C 安裝風(fēng)格: 封裝 / 箱體:TSSOP 封裝:Reel |
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