TA = 25°C, unless otherwise noted" />
參數(shù)資料
型號: AD5821ABCBZ-REEL7
廠商: Analog Devices Inc
文件頁數(shù): 14/17頁
文件大?。?/td> 0K
描述: IC DAC 10BIT CURRENTSINK 9-WLCSP
產品培訓模塊: Data Converter Fundamentals
DAC Architectures
產品變化通告: 8mm Carrier Tape Changes 28/Feb/2012
標準包裝: 1
設置時間: 250µs
位數(shù): 10
數(shù)據接口: 串行
轉換器數(shù)目: 1
電壓電源: 單電源
功率耗散(最大): 5mW
工作溫度: -30°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 9-UFBGA,WLCSP
供應商設備封裝: 9-WLCSP(1.52 x 1.69)
包裝: 標準包裝
輸出數(shù)目和類型: 1 電流,單極
采樣率(每秒): *
產品目錄頁面: 784 (CN2011-ZH PDF)
其它名稱: AD5821ABCBZ-REEL7DKR
AD5821
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
VDD to AGND
–0.3 V to +5.5 V
VDD to DGND
–0.3 V to VDD + 0.3 V
AGND to DGND
–0.3 V to +0.3 V
SCL, SDA to DGND
–0.3 V to VDD + 0.3 V
XSHUTDOWN to DGND
–0.3 V to VDD + 0.3 V
ISINK to AGND
–0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
30°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ MAX)
150°C
WLFCSP Power Dissipation
(TJ MAX TA)/θJA
θJA Thermal Impedance1
Mounted on 4-Layer Board
95°C/W
Lead Temperature, Soldering
Maximum Peak Reflow Temperature2
260°C (±5°C)
1 To achieve the optimum θJA, it is recommended that the AD5821
be soldered on a 4-layer board.
2 As per JEDEC J-STD-020C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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