Model1" />
參數(shù)資料
型號(hào): AD574AJDZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 7/12頁(yè)
文件大?。?/td> 0K
描述: IC ADC 12BIT W/REF 28-CDIP
標(biāo)準(zhǔn)包裝: 13
位數(shù): 12
采樣率(每秒): 28.6k
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 725mW
電壓電源: 雙 ±
工作溫度: 0°C ~ 70°C
安裝類型: 通孔
封裝/外殼: 28-CDIP(0.605",15.37mm)
供應(yīng)商設(shè)備封裝: 28-CDIP
包裝: 管件
輸入數(shù)目和類型: 2 個(gè)單端,單極;2 個(gè)單端,雙極
AD574A
REV. B
–4–
ORDERING GUIDE
Resolution
Max
Temperature
Linearity Error
No Missing Codes
Full Scale
Model1
Range
Max (TMIN to TMAX)(TMIN to TMAX)
T.C. (ppm/
°C)
AD574AJ(X)
0
°C to +70°C
±1 LSB
11 Bits
50.0
AD574AK(X)
0
°C to +70°C
±1/2 LSB
12 Bits
27.0
AD574AL(X)
0
°C to +70°C
±1/2 LSB
12 Bits
10.0
AD574AS(X)
2
–55
°C to +125°C
±1 LSB
11 Bits
50.0
AD574AT(X)
2
–55
°C to +125°C
±1 LSB
12 Bits
25.0
AD574AU(X)
2
–55
°C to +125°C
±1 LSB
12 Bits
12.5
NOTES
1X = Package designator. Available packages are: D (D-28) for all grades. E (E-28A) for J and K grades and /883B processed S, T
and U grades. N (N-28) for J, K, and L grades. P (P-28A) for PLCC in J, K grades. Example: AD574AKN is K grade in plastic DIP.
2For details on grade and package offerings screened in accordance with MIL-STD-883, refer to Analog Devices Military Products
Databook.
1
14
28
15
2
3
4
5
6
7
8
9
10
11
12
13
27
26
25
24
23
22
21
20
19
18
17
16
CONTROL
CLOCK
SAR
3
S
T
A
T
E
O
U
T
P
U
T
B
U
F
E
R
S
MSB
N
I
B
L
E
N
I
B
L
E
N
I
B
L
E
LSB
10V
REF
12
C
B
A
12
AD574A
3k
19.95k
9.95k
5k
N
DAC
VEE
8k
IREF
COMP
DIGITAL COMMON
DC
IDAC
IDAC =
4 x N x IREF
+5V SUPPLY
VLOGIC
DATA MODE SELECT
12/8
STATUS
STS
DB11
MSB
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
LSB
DIGITAL
DATA
OUTPUTS
CHIP SELECT
CS
BYTE ADDRESS/
SHORT CYCLE
AO
READ/CONVERT
R/C
CHIP ENABLE
CE
+12/+15V SUPPLY
VCC
+10V REFERENCE
REF OUT
ANALOG COMMON
AC
REFERENCE INPUT
REF IN
-12/-15V SUPPLY
VEE
BIPOLAR OFFSET
BIP OFF
10V SPAN INPUT
10VIN
20V SPAN INPUT
20VIN
AD574A Block Diagram and Pin Configuration
ABSOLUTE MAXIMUM RATINGS*
(Specifications apply to all grades, except where noted)
VCC to Digital Common . . . . . . . . . . . . . . . . . . 0 V to +16.5 V
VEE to Digital Common . . . . . . . . . . . . . . . . . . . 0 V to –16.5 V
VLOGIC to Digital Common . . . . . . . . . . . . . . . . . . 0 V to +7 V
Analog Common to Digital Common . . . . . . . . . . . . . . .
±1 V
Control Inputs (CE, CS, AO 12/8, R/C) to
Digital Common . . . . . . . . . . . . . . –0.5 V to VLOGIC + 0.5 V
Analog Inputs (REF IN, BIP OFF, 10 VIN) to
Analog Common . . . . . . . . . . . . . . . . . . . . . . . . . VEE to VCC
20 VIN to Analog Common . . . . . . . . . . . . . . . . . . . . . .
±24 V
REF OUT . . . . . . . . . . . . . . . . . . Indefinite Short to Common
Momentary Short to VCC
Chip Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 mW
Lead Temperature (Soldering, 10 sec). . . . . . . . . . . . . +300
°C
Storage Temperature (Ceramic) . . . . . . . . . . –65
°C to +150°C
(Plastic) . . . . . . . . . . . . . . . . . . . . . . . . . . . –25
°C to +100°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
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