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參數(shù)資料
| 型號： | AD5432 |
| 廠商： | Analog Devices, Inc. |
| 元件分類： | 串行DAC |
| 英文描述： | Dual 8-,10-,12-Bit High Bandwidth Multiplying DACs with Serial Interface |
| 中文描述： | 雙8 - ，10 - 12位高帶寬倍增DAC的串行接口 |
| 文件頁數(shù)： | 24/32頁 |
| 文件大小： | 860K |
| 代理商： | AD5432 |
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AD5429/AD5439/AD5449
PCB LAYOUT AND POWER SUPPLY DECOUPLING
In any circuit where accuracy is important, careful consider-
ation of the power supply and ground return layout helps to
ensure the rated performance. The printed circuit board on
which the DAC is mounted should be designed so that the
analog and digital sections are separated and confined to
certain areas of the board. If the DAC is in a system in which
multiple devices require an AGND to DGND connection, the
connection should be made at one point only. The star ground
point should be established as close as possible to the device.
Rev. 0 | Page 24 of 32
These DACs should have ample supply bypassing of 10 μF
in parallel with 0.1 μF on the supply located as close to the
package as possible, ideally right up against the device. The
0.1 μF capacitor should have low effective series resistance
(ESR) and effective series inductance (ESI), like the common
ceramic types that provide a low impedance path to ground at
high frequencies, to handle transient currents due to internal
logic switching. Low ESR 1 μF to 10 μF tantalum or electrolytic
capacitors should also be applied at the supplies to minimize
transient disturbance and filter out low frequency ripple.
Fast switching signals such as clocks should be shielded with
digital ground to avoid radiating noise to other parts of the
board, and should never be run near the reference inputs.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
reduces the effects of feedthrough on the board. A microstrip
technique is by far the best, but not always possible with a
double-sided board. In this technique, the component side of
the board is dedicated to the ground plane, while signal traces
are placed on the soldered side.
It is good practice to employ compact, minimum lead-length
PCB layout design. Leads to the input should be as short as
possible to minimize IR drops and stray inductance.
The PCB metal traces between V
REF
and R
FB
should also be
matched to minimize gain error. To maximize high frequency
performance, the I-to-V amplifier should be located as close to
the device as possible.
POWER SUPPLIES FOR THE EVALUATION BOARD
The board requires ±12 V and +5 V supplies. The 12 V V
DD
and V
SS
are used to power the output amplifier, while the 5 V
is used to power the DAC (V
DD1
) and transceivers (V
CC
).
Both supplies are decoupled to their respective ground plane
with 10 μF tantalum and 0.1 μF ceramic capacitors.
EVALUATION BOARD FOR THE DACS
The evaluation board includes a DAC from the AD5429/
AD5439/AD5449 family and a current-to-voltage amplifier,
AD8065. On the evaluation board is a 10 V reference, ADR01.
An external reference can also be applied via an SMB input.
The evaluation kit consists of a CD-ROM with self-installing
PC software to control the DAC. The software allows the user to
write a code to the device.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AD5433 | Dual 8-,10-,12-Bit High Bandwidth Multiplying DACs with Serial Interface |
| AD5439 | Dual 10-Bit High Bandwidth Multiplying DACs with Serial Interface |
| AD8038 | Dual 8-,10-,12-Bit High Bandwidth Multiplying DACs with Serial Interface |
| AD8038AKS-REEL | JT 22C 22#22D PIN PLUG |
| AD5439YRU | DIODE ZENER SINGLE 200mW 3.9Vz 20mA-Izt 0.05 10uA-Ir 1 SOD-323 3K/REEL |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD5432BRM | 制造商:Analog Devices 功能描述:DAC SGL R-2R 10-BIT 10PIN USOIC - Bulk |
| AD5432YRM | 功能描述:IC DAC MULTIPLYING 10BIT 10-MSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產(chǎn)品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標(biāo)準(zhǔn)包裝:91 系列:- 設(shè)置時間:4µs 位數(shù):10 數(shù)據(jù)接口:MICROWIRE?，串行，SPI? 轉(zhuǎn)換器數(shù)目:8 電壓電源:單電源 功率耗散（最大）:2.7mW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:14-DFN-EP（4x3） 包裝:管件 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
| AD5432YRM-REEL | 制造商:Analog Devices 功能描述:DAC 1-CH R-2R 10-bit 10-Pin MSOP T/R 制造商:Analog Devices 功能描述:DAC 1CH R-2R 10-BIT 10MSOP - Tape and Reel 制造商:Rochester Electronics LLC 功能描述:10-IOUT DAC WITH SERIAL ITF I.C. - Tape and Reel |
| AD5432YRM-REEL7 | 功能描述:IC DAC 10BIT MULTIPLYING 10-MSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| AD5432YRMZ | 功能描述:IC DAC 10BIT MULTIPLYING 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 設(shè)置時間:4µs 位數(shù):12 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-uMAX 包裝:管件 輸出數(shù)目和類型:2 電壓，單極 采樣率（每秒）:* 產(chǎn)品目錄頁面:1398 (CN2011-ZH PDF) |
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