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| 型號： | AD5422AREZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 32/44頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 16BIT SER 24TSSOP |
| 設(shè)計資源： | 16-Bit Fully Isolated Output Module Using AD5422 and ADuM1401 (CN0065) Simplified 16-Bit Voltage Output and 4 mA-to-20 mA Output Solution Using AD5422 (CN0077) |
| 標準包裝： | 62 |
| 設(shè)置時間： | 25µs |
| 位數(shù)： | 16 |
| 數(shù)據(jù)接口： | MICROWIRE?，串行，SPI? |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字，雙 ± |
| 功率耗散（最大）： | 950mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-TSSOP（0.173"，4.40mm）裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 24-TSSOP 裸露焊盤 |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 1 電流，單極；1 電流，雙極；1 電壓，單極；1 電壓，雙極 |
| 采樣率（每秒）： | 40k |
| 產(chǎn)品目錄頁面： | 782 (CN2011-ZH PDF) |
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AD5412/AD5422
Data Sheet
Rev. I | Page 38 of 44
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration of
the power supply and ground return layout helps to ensure the
rated performance. Design the printed circuit board (PCB) on
digital sections are separated and confined to certain areas of the
devices require an analog ground-to-digital ground connection,
make the connection at one point only. Establish the star ground
point as close as possible to the device.
10 F in parallel with 0.1 F on each supply located as close to
the package as possible, ideally right up against the device. The
10 F capacitors are the tantalum bead type. The 0.1 F capacitor
should have low effective series resistance (ESR) and low effective
series inductance (ESI), such as the common ceramic types,
which provide a low impedance path to ground at high frequencies
to handle transient currents due to internal logic switching.
large a trace as possible to provide low impedance paths and reduce
the effects of glitches on the power supply line. Fast switching
signals such as clocks should be shielded with a digital ground
to avoid radiating noise to other parts of the board. Never run these
near the reference inputs. A ground line routed between the SDIN
and SCLK lines helps reduce crosstalk between them (this is not
required on a multilayer board that has a separate ground plane,
but separating the lines helps). It is essential to minimize noise
on the REFIN line because it couples through to the DAC output.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the PCB should run at right angles to each
other. This reduces the effects of feed through the board. A
microstrip technique is by far the best but not always possible
with a double-sided board. In this technique, the component
side of the board is dedicated to the ground plane, and signal
traces are placed on the solder side.
THERMAL AND SUPPLY CONSIDERATIONS
junction temperature of 125°C. It is important that the devices
not be operated under conditions that cause the junction
temperature to exceed this value. Excessive junction tempera-
maximum AVDD while driving the maximum current (24 mA)
directly to ground. In this case, control the ambient temperature
or reduce AVDD. The conditions depend on the device package.
At the maximum ambient temperature of 85°C, the 24-lead TSSOP
package can dissipate 1.14 mW, and the 40-lead LFCSP package
can dissipate 1.21 W.
To ensure that the junction temperature does not exceed 125°C
while driving the maximum current of 24 mA directly into ground
(also adding an on-chip current of 3 mA), reduce AVDD from the
maximum rating to ensure that the package is not required to
dissipate more power than previously stated (see Table 25,
Figure 80, and Figure 81).
0
0.5
1.0
1.5
2.0
2.5
40
45
50
55
60
65
70
75
80
85
AMBIENT TEMPERATURE (°C)
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
LFCSP
TSSOP
06996-
066
Figure 80. Maximum Power Dissipation vs. Ambient Temperature
25
27
29
31
33
35
37
39
41
43
45
25
35
45
55
65
75
85
AMBIENT TEMPERATURE (°C)
SU
PPL
Y
VO
L
T
A
G
E
(V)
06996-
067
TSSOP
LFCSP
Figure 81. Maximum Supply Voltage vs. Ambient Temperature
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| AD5422AREZ-REEL | 功能描述:IC DAC 16BIT SRL 24TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標準包裝:47 系列:- 設(shè)置時間:2µs 位數(shù):14 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:* |
| AD5422BCPZ | 制造商:AD 制造商全稱:Analog Devices 功能描述:Single Channel, 16-Bit, Serial Input, Current Source & Voltage Output DAC |
| AD5422BCPZ-REEL | 功能描述:IC DAC 16BIT SRL 40LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標準包裝:47 系列:- 設(shè)置時間:2µs 位數(shù):14 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:* |
| AD5422BCPZ-REEL7 | 功能描述:IC DAC 16BIT SRL 40LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 設(shè)置時間:4µs 位數(shù):12 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-uMAX 包裝:管件 輸出數(shù)目和類型:2 電壓，單極 采樣率（每秒）:* 產(chǎn)品目錄頁面:1398 (CN2011-ZH PDF) |
| AD5422BREZ | 功能描述:IC DAC 16BIT 1CH 24TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 設(shè)置時間:4µs 位數(shù):12 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-uMAX 包裝:管件 輸出數(shù)目和類型:2 電壓，單極 采樣率（每秒）:* 產(chǎn)品目錄頁面:1398 (CN2011-ZH PDF) |
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