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參數(shù)資料
| 型號： | AD534JHZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 20/21頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULT DIV LASER TRIM TO100-10 |
| 標準包裝： | 1 |
| 功能： | 模擬乘法器/除法器 |
| 位元/級數(shù)： | 四象限 |
| 封裝/外殼： | TO-100-10 金屬罐 |
| 供應商設備封裝： | TO-100-10 |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁面： | 789 (CN2011-ZH PDF) |
Data Sheet
AD534
Rev. D | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
±18 V
±22 V
Internal Power Dissipation
500 mW
Output Short Circuit to
Ground
Indefinite
Input Voltages (X1, X2, Y1, Y2,
Z1, Z2)
±VS
Rated Operating
Temperature Range
0°C to +70°C
55°C to +125°C
Storage Temperature
Range
65°C to +150°C
Lead Temperature Range,
60 sec Soldering
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
10-Pin TO-100 (H-10)
150
25
°C/W
14-Lead SBDIP (D-14)
95
25
°C/W
20-Terminal LCC (E-20-1)
95
25
°C/W
09
67
5-
00
4
Z1
Z2
–VS
+VS
Y2
Y1
SF
X2
X1
OUT
0.076
(1.93)
0.100 (2.54)
5
3
4
8
A
Figure 2. Chip Dimensions and Bonding Diagram
Dimensions shown in inches and (mm)
Contact factory for latest dimensions.
09
675-
005
+VS
–VS
50k
1k
TO APPROPRIATE
INPUT TERMINAL
470k
Figure 3. Optional Trimming Configuration
ESD CAUTION
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