參數(shù)資料
型號(hào)： AD5318
廠商： Analog Devices, Inc.
英文描述： 2.5 V to 5.5 V Octal Voltage Output 8-/10-/12-Bit DACs in 16-Lead TSSOP
中文描述： 2.5 V至5.5 V電壓輸出8-/10-/12-Bit八路數(shù)模轉(zhuǎn)換器的16引腳TSSOP
文件頁數(shù)： 4/19頁
文件大小： 308K
代理商： AD5318
REV. B
–4–
AD5308/AD5318/AD5328
ABSOLUTE MAXIMUM RATINGS
1, 2
(T
A
= 25
°
C, unless otherwise noted.)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . –0.3 V to V
DD
+ 0.3 V
Reference Input Voltage to GND . . . . –0.3 V to V
DD
+ 0.3 V
V
OUT
A–V
OUT
D to GND . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (A, B Version) . . . . . . . . . . . . . –40
°
C to +105
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature (T
J MAX
) . . . . . . . . . . . . . . . . . . . 150
°
C
ORDERING GUIDE
Model
Temperature Range
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
–40
°
C to +105
°
C
Package Description
Package Option
AD5308ARU
AD5308ARU-REEL7
AD5308BRU
AD5308BRU-REEL
AD5308BRU-REEL7
AD5318ARU
AD5318ARU-REEL7
AD5318BRU
AD5318BRU-REEL
AD5318BRU-REEL7
AD5318BRUZ
*
AD5318BRUZ-REEL
*
AD5318BRUZ-REEL7
*
AD5328ARU
AD5328ARU-REEL7
AD5328BRU
AD5328BRU-REEL
AD5328BRU-REEL7
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
*
Z = Pb-free part.
16-Lead TSSOP
Power Dissipation . . . . . . . . . . . . . . . . . . . (T
J MAX
– T
A
)/
JA
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . 150.4
°
C/W
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
Time at Peak Temperature . . . . . . . . . . . . . 10 sec to 40 sec
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD5308/AD5318/AD5328 feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
相關(guān)PDF資料
PDF描述
AD530D Integtated Circuit Multiplier,Divider,Squarer,Square Rooster
AD530H 14 Bit 80 MSPS Analog-to-Digital Converter 52-QFP -40 to 85
AD530J Integtated Circuit Multiplier,Divider,Squarer,Square Rooster
AD530K 14 Bit 80 MSPS Analog-to-Digital Converter 52-QFP -40 to 85
AD530L Integtated Circuit Multiplier,Divider,Squarer,Square Rooster
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD5318ARU 功能描述:IC DAC 10BIT OCTAL W/BUF 16TSSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:47 系列:- 設(shè)置時(shí)間:2µs 位數(shù):14 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:*
AD5318ARU-REEL7 功能描述:IC DAC 10BIT OCTAL W/BUF 16TSSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:*
AD5318ARUZ 功能描述:IC DAC 10BIT OCTAL W/BUF 16TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 設(shè)置時(shí)間:4µs 位數(shù):12 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-uMAX 包裝:管件 輸出數(shù)目和類型:2 電壓，單極 采樣率（每秒）:* 產(chǎn)品目錄頁面:1398 (CN2011-ZH PDF)
AD5318ARUZ 制造商:Analog Devices 功能描述:IC DAC 10BIT 167KSPS 16TSSOP
AD5318ARUZ-REEL7 功能描述:IC DAC 10BIT OCTAL W/BUF 16TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 設(shè)置時(shí)間:4µs 位數(shù):12 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-uMAX 包裝:管件 輸出數(shù)目和類型:2 電壓，單極 采樣率（每秒）:* 產(chǎn)品目錄頁面:1398 (CN2011-ZH PDF)
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