TA = 25°C, unless o" />
參數(shù)資料
型號(hào): AD5317ARU
廠商: Analog Devices Inc
文件頁(yè)數(shù): 26/28頁(yè)
文件大?。?/td> 0K
描述: IC DAC 10BIT QUAD W/BUFF 16TSSOP
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
產(chǎn)品變化通告: Product Discontinuance 27/Oct/2011
標(biāo)準(zhǔn)包裝: 96
設(shè)置時(shí)間: 7µs
位數(shù): 10
數(shù)據(jù)接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 4
電壓電源: 單電源
工作溫度: -40°C ~ 105°C
安裝類型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 16-TSSOP
包裝: 管件
輸出數(shù)目和類型: 4 電壓,單極;4 電壓,雙極
采樣率(每秒): 143k
AD5307/AD5317/AD5327
Rev. C | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter1
Ratings
VDD to GND
0.3 V to +7 V
Digital Input Voltage to GND
0.3 V to VDD + 0.3 V
Digital Output Voltage to GND
0.3 V to VDD + 0.3 V
Reference Input Voltage to GND
0.3 V to VDD + 0.3 V
VOUTA VOUTD to GND
0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (A, B Versions)
40°C to +105°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ max)
150°C
16-Lead TSSOP
Power Dissipation
(TJ max TA)/θJA
θJA Thermal Impedance
150.4°C/W
Reflow Soldering
Peak Temperature
220°C
Time at Peak Temperature
10 sec to 40 sec
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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