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| 型號： | AD5316BRUZ-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 15/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 10BIT QUAD W/BUFF 16TSSOP |
| 產(chǎn)品培訓模塊： | Data Converter Fundamentals DAC Architectures |
| 產(chǎn)品變化通告： | Product Discontinuance 27/Oct/2011 |
| 標準包裝： | 2,500 |
| 設(shè)置時間： | 7µs |
| 位數(shù)： | 10 |
| 數(shù)據(jù)接口： | I²C，串行 |
| 轉(zhuǎn)換器數(shù)目： | 4 |
| 電壓電源： | 單電源 |
| 功率耗散（最大）： | 4.5mW |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應商設(shè)備封裝： | 16-TSSOP |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | 4 電壓，單極；4 電壓，雙極 |
| 采樣率（每秒）： | 143k |
AD5306/AD5316/AD5326
Rev. F | Page 22 of 24
POWER SUPPLY DECOUPLING
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The printed circuit board on which the
AD5306/AD5316/AD5326 is mounted should be designed so
the analog and digital sections are separated and confined to
certain areas of the board.
If the AD5306/AD5316/AD5326 is in a system where multiple
devices require an AGND-to-DGND connection, the connection
should be made at one point only. The star ground point should
be established as close as possible to the device. The AD5306/
AD5316/AD5326 should have ample supply bypassing of 10 μF
in parallel with 0.1 μF on the supply located as close to the
package as possible, ideally right up against the device. The 10 μF
capacitors are the tantalum bead type. The 0.1 μF capacitor should
have low effective series resistance (ESR) and low effective
series inductance (ESI), like the common ceramic types that
provide a low impedance path to ground at high frequencies to
handle transient currents due to internal logic switching.
The power supply lines of the AD5306/AD5316/AD5326 should
use as large a trace as possible to provide low impedance paths
and reduce the effects of glitches on the power supply line.
Components with fast-switching signals, such as clocks, should
be shielded with digital ground to avoid radiating noise to other
parts of the board, and they should never be run near the
reference inputs. A ground line routed between the SDA and
SCL lines helps to reduce crosstalk between them. Although a
ground line is not required on a multilayer board because there is
a separate ground plane, separating the lines helps.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
reduces the effects of feedthrough through the board. A micro-
strip technique is the best method, but its use is not always
possible with a double-sided board. In this technique, the
component side of the board is dedicated to ground plane while
signal traces are placed on the solder side.
Table 8. Overview of AD53xx Serial Devices1
Part No.
Resolution
No. of DACs
DNL
Interface
Settling Time (μs)
Package
Pins
SINGLES
AD5300
8
1
±0.25
SPI
4
SOT-23, MSOP
6, 8
AD5310
10
1
±0.5
SPI
6
SOT-23, MSOP
6, 8
AD5320
12
1
±1.0
SPI
8
SOT-23, MSOP
6, 8
AD5301
8
1
±0.25
2-wire
6
SOT-23, MSOP
6, 8
AD5311
10
1
±0.5
2-wire
7
SOT-23, MSOP
6, 8
AD5321
12
1
±1.0
2-wire
8
SOT-23, MSOP
6, 8
DUALS
AD5302
8
2
±0.25
SPI
6
MSOP
8
AD5312
10
2
±0.5
SPI
7
MSOP
8
AD5322
12
2
±1.0
SPI
8
MSOP
8
AD5303
8
2
±0.25
SPI
6
TSSOP
16
AD5313
10
2
±0.5
SPI
7
TSSOP
16
AD5323
12
2
±1.0
SPI
8
TSSOP
16
QUADS
AD5304
8
4
±0.25
SPI
6
MSOP
10
AD5314
10
4
±0.5
SPI
7
MSOP
10
AD5324
12
4
±1.0
SPI
8
MSOP
10
AD5305
8
4
±0.25
2-Wire
6
MSOP
10
AD5315
10
4
±0.5
2-Wire
7
MSOP
10
AD5325
12
4
±1.0
2-Wire
8
MSOP
10
AD5306
8
4
±0.25
2-Wire
6
TSSOP
16
AD5316
10
4
±0.5
2-Wire
7
TSSOP
16
AD5326
12
4
±1.0
2-Wire
8
TSSOP
16
AD5307
8
4
±0.25
SPI
6
TSSOP
16
AD5317
10
4
±0.5
SPI
7
TSSOP
16
AD5327
12
4
±1.0
SPI
8
TSSOP
16
OCTALS
AD5308
8
±0.25
SPI
6
TSSOP
16
AD5318
10
8
±0.5
SPI
7
TSSOP
16
AD5328
12
8
±1.0
SPI
8
TSSOP
16
1 Visit www.analog.com/support/standard_linear/selection_guides/AD53xx.html for more information.
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