TA = 25°C, unless o" />
參數(shù)資料
型號: AD5315ARMZ-REEL7
廠商: Analog Devices Inc
文件頁數(shù): 22/24頁
文件大?。?/td> 0K
描述: IC DAC 10BIT OCTAL W/BUF 10-MSOP
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 1
設(shè)置時間: 6µs
位數(shù): 10
數(shù)據(jù)接口: I²C,串行
轉(zhuǎn)換器數(shù)目: 4
電壓電源: 單電源
功率耗散(最大): 5mW
工作溫度: -40°C ~ 105°C
安裝類型: 表面貼裝
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 10-MSOP
包裝: 標(biāo)準(zhǔn)包裝
輸出數(shù)目和類型: 4 電壓,單極;4 電壓,雙極
采樣率(每秒): 143k
產(chǎn)品目錄頁面: 782 (CN2011-ZH PDF)
其它名稱: AD5315ARMZ-REEL7DKR
AD5305/AD5315/AD5325
Rev. G | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter1
Rating
VDD to GND
–0.3 V to +7 V
SCL, SDA to GND
–0.3 V to VDD + 0.3 V
A0 to GND
–0.3 V to VDD + 0.3 V
Reference Input Voltage to GND
–0.3 V to VDD + 0.3 V
VOUTA to VOUTD to GND
–0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (A, B Version)
40°C to +105°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ max)
150°C
MSOP
Power Dissipation
(TJ max TA)/θJA
θJA Thermal Impedance
206°C/W
θJC Thermal Impedance
44°C/W
Reflow Soldering
Peak Temperature
220°C
Time at Peak Temperature
10 sec to 40 sec
1 Transient currents of up to 100 mA do not cause SCR latcth-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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