AD5204/AD5206
Rev. C | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 2.
Parameter
Rating
VDD to GND
0.3 V to +7 V
VSS to GND
0 V to 7 V
VDD to VSS
7 V
VA, VB, VW to GND
VSS, VDD
IA, IB, IW
±20 mA
Continuous
10 kΩ End-to-End Resistance
±11 mA
50 kΩ and 100 kΩ End-to-End
Resistance
±2.5 mA
Digital Input and Output Voltage
to GND
0.3 V to (VDD + 0.3 V) or 7 V
(whichever is less)
Operating Temperature Range
40°C to +85°C
Maximum Junction Temperature
(TJ max)
150°C
Storage Temperature
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Package Power Dissipation
(TJ max TA)/θJA
PDIP (N-24-1)
63°C/W
SOIC (RW-24)
52°C/W
TSSOP (RU-24)
50°C/W
LFCSP (CP-32-3)
32.5°C/W
ESD CAUTION
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Thermal resistance (JEDEC 4-layer (2S2P) board). Paddle soldered to board.