Changed VA
參數(shù)資料
型號(hào): AD5173BRM100-RL7
廠(chǎng)商: Analog Devices Inc
文件頁(yè)數(shù): 22/28頁(yè)
文件大?。?/td> 0K
描述: IC DGTL POT DUAL 100K OTP 10MSOP
標(biāo)準(zhǔn)包裝: 1,000
接片: 256
電阻(歐姆): 100k
電路數(shù): 2
溫度系數(shù): 標(biāo)準(zhǔn)值 35 ppm/°C
存儲(chǔ)器類(lèi)型: 非易失
接口: I²C(設(shè)備位址)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 10-MSOP
包裝: 帶卷 (TR)
Data Sheet
AD5172/AD5173
Rev. I | Page 3 of 28
REVISION HISTORY
8/13—Rev. H to Rev. I
Changed VA, VB, VW to GND and Digital Inputs and Output
Voltage to GND Rating to 0.3 V to +7 V or VDD + 0.3 V
(whichever is less); Table 4...............................................................7
Changes to Ordering Guide...........................................................25
4/09—Rev. G to Rev. H
Changes to DC Characteristics—Rheostat Mode Parameter and
to DC Characteristics—Potentiometer Divider Mode Parameter,
Table 1.................................................................................................3
12/08—Rev. F to Rev. G
Changes to OTP Supply Voltage Parameter, Table 1 ....................3
Changes to OTP Supply Voltage Parameter, Table 2 ....................5
Changes to Table 5 and Table 6 .......................................................8
Changes to One-Time Programming (OTP) Section ................15
Changes to Power Supply Considerations Section, Figure 46,
and Figure 46 Caption ....................................................................17
Changes to Ordering Guide...........................................................23
7/08—Rev. E to Rev. F
Changes to Power Supplies Parameter in Table 1 and Table 2 ....3
Updated Fuse Blow Condition to 400 ms Throughout................5
1/08—Rev. D to Rev. E
Changes to Features ..........................................................................1
Changes to General Description .....................................................1
Changes to OTP Supply Voltage and OTP Supply Current in
Table 1.................................................................................................3
Changes to OTP Supply Voltage and OTP Supply Current in
Table 2.................................................................................................5
Added OTP Program Time in Table 3............................................6
Changes to Table 4 ............................................................................7
Changes to Table 5 and Table 6 .......................................................8
Inserted Figure 30............................................................................13
Replaced One-Time Programming (OTP) Section....................15
Replaced Power Supply Considerations Section.........................17
Deleted Device Programming Software Section.........................20
Replaced I2C-Compatible, 2-Wire Serial Bus Section................21
Changes to Ordering Guide...........................................................23
6/06—Rev. C to Rev. D
Changes to Features ..........................................................................1
Changes to One-Time Programming (OTP) Section ................15
Changes to Figure 44 and Figure 45 .............................................17
Changes to Power Supply Considerations Section .....................18
Changes to Figure 46 and Figure 47 .............................................18
Changes to Device Programming Software Section...................19
Updated Outline Dimensions........................................................24
6/05—Rev. B to Rev. C
Added Footnote 8, Footnote 9, and Footnote 10 to Table 1........3
Added Footnote 8 to Table 2............................................................5
Changes to Table 5 and Table 6 .......................................................9
Changes to Power Supply Considerations Section .....................17
Changes to I2C-Compatible 2-Wire Serial Bus Section .............23
Added Level Shifting for Different Voltage Operation Section.......24
Updated Outline Dimensions........................................................25
Changes to Ordering Guide...........................................................25
10/04—Rev. A to Rev. B
Updated Format ................................................................ Universal
Changes to Specifications.................................................................3
Changes to One-Time Programming (OTP) Section ................13
Changes to Power Supply Considerations Section .....................15
Changes to Figure 44 and Figure 45 .............................................15
Changes to Figure 46 and Figure 47 .............................................16
11/03—Rev. 0 to Rev. A
Changes to Electrical Characteristics—2.5 k .............................3
11/03—Revision 0: Initial Version
相關(guān)PDF資料
PDF描述
VE-B6P-MY-F2 CONVERTER MOD DC/DC 13.8V 50W
VE-B6P-MY-F1 CONVERTER MOD DC/DC 13.8V 50W
VE-B6N-MY-F4 CONVERTER MOD DC/DC 18.5V 50W
AD5173BRM10-RL7 IC DGTL POT DUAL 10K OTP 10-MSOP
AD5172BRM2.5-RL7 IC DGTL POT DUAL OTP 10-MSOP T/R
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD5173BRM10-RL7 功能描述:IC DGTL POT DUAL 10K OTP 10-MSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:DPP 接片:32 電阻(歐姆):10k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 300 ppm/°C 存儲(chǔ)器類(lèi)型:非易失 接口:3 線(xiàn)串行(芯片選擇,遞增,增/減) 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-TDFN(2x3) 包裝:帶卷 (TR)
AD5173BRM2.5 功能描述:IC DGTL POT DUAL 2.5K OTP 10MSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:DPP 接片:32 電阻(歐姆):10k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 300 ppm/°C 存儲(chǔ)器類(lèi)型:非易失 接口:3 線(xiàn)串行(芯片選擇,遞增,增/減) 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-TDFN(2x3) 包裝:帶卷 (TR)
AD5173BRM2.5-RL7 功能描述:IC DGTL POT DUAL 2.5K OTP 10MSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:DPP 接片:32 電阻(歐姆):10k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 300 ppm/°C 存儲(chǔ)器類(lèi)型:非易失 接口:3 線(xiàn)串行(芯片選擇,遞增,增/減) 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-TDFN(2x3) 包裝:帶卷 (TR)
AD5173BRM50 功能描述:IC DGTL POT DUAL 50K OTP 10-MSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:DPP 接片:32 電阻(歐姆):10k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 300 ppm/°C 存儲(chǔ)器類(lèi)型:非易失 接口:3 線(xiàn)串行(芯片選擇,遞增,增/減) 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-TDFN(2x3) 包裝:帶卷 (TR)
AD5173BRM50-RL7 功能描述:IC DGTL POT DUAL 50K OTP 10-MSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:DPP 接片:32 電阻(歐姆):10k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 300 ppm/°C 存儲(chǔ)器類(lèi)型:非易失 接口:3 線(xiàn)串行(芯片選擇,遞增,增/減) 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-TDFN(2x3) 包裝:帶卷 (TR)