參數(shù)資料
型號(hào): ACTS10D
廠(chǎng)商: Intersil Corporation
英文描述: Radiation Hardened Triple Three-Input NAND Gate
中文描述: 輻射加固三三輸入與非門(mén)
文件頁(yè)數(shù): 6/8頁(yè)
文件大?。?/td> 112K
代理商: ACTS10D
6
ACTS10MS
Metallization Mask Layout
ACTS10MS
B1
(02)
A1
(01)
VCC
(14)
C1
(13)
A3
(09)
Y3
(08)
GND
(07)
Y2
(06)
A2 (03)
B2 (04)
NC
C2 (05)
(10) B3
NC
(11) C3
(12) Y1
Die Characteristics
DIE DIMENSIONS:
88 mils x 88 mils
2,240mm x 2,240mm
METALLIZATION:
Type: AlSiCu
Metal 1 Thickness: 6.75k
(Min), 8.25k
(Max)
Metal 2 Thickness: 9k
(Min), 11k
(Max)
GLASSIVATION:
Type: SiO
2
Thickness: 8k
±
1k
DIE ATTACH:
Material: Silver Glass or JM 7000 after 7/1/95
WORST CASE CURRENT DENSITY:
< 2.0 x 10
5
A/cm
2
BOND PAD SIZE:
> 4.3 mils x 4.3 mils
> 110
μ
m x 110
μ
m
Spec Number
518823
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