
eroflex Circuit Technology - Advanced Multichip Modules SCD3659 REV 3 12/17/98
128Kx8
128Kx8
128Kx8
128Kx8
CE
4
OE
A
0
– A
16
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
8
8
8
8
CE
3
WE
CE
1
CE
2
Block Diagram – PGA Type Package(P1) & CQFP(F2)
128Kx8
128Kx8
128Kx8
128Kx8
CE
4
OE
A
0
–
A
16
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
8
8
8
8
CE
3
WE
4
WE
3
WE
2
WE
1
CE
1
CE
2
Block Diagram – CQFP(F1)
Pin Description
I/O
0-31
Data I/O
A
0–16
Address Inputs
WE
1–4
Write Enables
CE
1–4
Chip Enables
OE
Output Enable
V
cc
Power Supply
GND
Ground
NC
Not Connected
Pin Description
I/O
0-31
Data I/O
A
0–16
Address Inputs
WE
Write Enable
CE
1–4
Chip Enables
OE
Output Enable
V
cc
Power Supply
GND
Ground
NC
Not Connected
General Description
The ACT–RS128K32 is a High
Speed 4 megabit CMOS SRAM
Multichip
Module
designed for full temperature
range, military, space, or high
reliability mass memory and
fast cache applications.
The MCM can be organized
as a 128K x 32 bits, 256K x 16
bits or 512k x 8 bits device and
is
input
and
compatible. Writing is executed
when the write enable (WE)
and chip enable (CE) inputs are
low. Reading is accomplished
when WE is high and CE and
output enable (OE) are both
low. Access time grades of
35ns and 45ns maximum are
standard.
The +5 Volt power supply
version is standard.
The products are designed for
operation over the temperature
range of -55°C to +125°C and
screened under the full military
environment. DESC Standard
Military Drawing (SMD) part
numbers are pending.
The
ACT-RS128K32
manufactured
80,000ft
2
MIL-PRF-38534
certified facility in Plainview,
N.Y.
(MCM)
output
TTL
is
in
Aeroflex’s
Features
I
4 Low Power CMOS 128K x 8 SRAMs in one MCM
I
Overall configuration as 128K x 32
I
Tolerant to 30KRad (Si)
I
Latch-up Immunity to 112MeV/(mg/cm
2
)
I
Input and Output TTL Compatible
I
35 & 45ns Access Times
I
Full Military (-55°C to +125°C) Temperature Range
I
For Class K devices per MIL-PRF-38534 - Consult Factory
I
+5V Power Supply
I
Choice of 4 Hermetically sealed Co-fired Packages:
G
68–Lead, Low Profile CQFP (F1), 1.56"SQ x .140"max
G
68–Lead, Dual-Cavity CQFP (F2), .88"SQ x .20"max (.18"max thickness
available, contact factory for details)
(Drops into the 68 Lead JEDEC .99"SQ
CQFJ footprint)
G
66–Lead, PGA-Type (P1), 1.385"SQ x .245"max
I
Internal Decoupling Capacitors
CIRCUIT TECHNOLOGY
www.aeroflex.com/act1.htm
4 Megabit SRAM Multichip Module
Preliminary
ACT–RS128K32 High Speed
RAD Tolerant