參數(shù)資料
型號(hào): ACPM-7886-BLK
元件分類: 放大器
英文描述: 2010 MHz - 2025 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封裝: 4.0 X 4.0 MM, LEAD FREE, SMT, 10 PIN
文件頁(yè)數(shù): 2/14頁(yè)
文件大?。?/td> 339K
代理商: ACPM-7886-BLK
10
Figure 6. TD-SCDMA frame.[1]
Solder Paste Recommendation
The ACPM-7886 package is a lead free package that was
proven to pass MSL3 when reowed under lead free
solder reow prole. The recommended lead free solder
for SMT reow is Sn-Ag-Cu (95.5% Tin, 3.8% Silver, 0.7%
Copper) or other similar Sn-Ag-Cu solders. This lead
free solder paste has a melting point of 218°C (423°F),
the ternary eutectic of Sn-Ag-Cu system, giving it the
advantage of being the lowest melting lead free alterna-
tive. This temperature is still low enough to protect from
damaging the internal circuitry during solder reow
operations provided the exposure time at peak reow
temperatures is not too excessive.
In certain situations, the designer may use leaded solder
paste for reow. The recommended solder for mounting
ACPM-7886 package is Sn63 (63% Sn, 37% Pb). It is a
eutectic compound with a typical melting point of 183°C.
Application Information
Introduction
The ACPM-7886 amplier module is designed for TD-
SCDMA applications in the 2010-2025MHz band. This
power amplier is able to produce excellent results for
the emerging Chinese standard, TD-SCDMA. Typical
ACLR performance at Vdd is 41dBc with Pout of 28dBm
and 41% eciency.
Background
In 1999 the China Academy of Telecommunications Tech-
nology (CATT) and Siemens proposed a new 3G standard
that would rival WCDMA and CDMA2000 data rates. Time
Domain Synchronous Code Domain Access (TD-SCDMA)
combines both CDMA and TDMA technologies. It ben-
ets from CDMA capacity as well as being compatible
with current GSM networks. But unlike existing WCDMA,
CDMA2000 and GSM networks, this new standard trans-
mits and receives on the same frequency thus greatly
increasing spectrum eciency. Figure 6 simplies this
explanation by showing one TD-SCDMA frame with 7
slots and 16 channelization codes in each slot.
ACPM-7886 Test Setup
The test setup for measuring a TD-SCDMA power module
resembles a GSM test. Specically, it is very important to
properly congure the timing for the test instruments
and the device under test. In GSM, in order to turn ON
and OFF each time slot, a controlled pin on the PA is trig-
gered with a pulse period of 4.615ms and a 12% duty
cycle (577uS). This pin is usually labeled as Vapc on most
GSM PAs.
相關(guān)PDF資料
PDF描述
ACPM-7886-TR1 2010 MHz - 2025 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
AD22100ARZ-REEL7 ANALOG TEMP SENSOR-VOLTAGE, 0.47-3.28V, RECTANGULAR, SURFACE MOUNT
AD590JRZ-REEL ANALOG TEMP SENSOR-CURRENT, 298.2uA, RECTANGULAR, SURFACE MOUNT
AD590JRZ-RL ANALOG TEMP SENSOR-CURRENT, 298.2uA, RECTANGULAR, SURFACE MOUNT
AD590JFZ ANALOG TEMP SENSOR-CURRENT, 298.2uA, RECTANGULAR, THROUGH HOLE MOUNT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ACPM-7886-TR1 制造商:Avago Technologies 功能描述:POWER AMP TD-SCDMA 4X4MM
ACPM-7887-TR1 制造商:Avago Technologies 功能描述:PA MODULE, TD-SCDA PA, 4X4MM
ACPM-7891 制造商:HP 制造商全稱:Agilent(Hewlett-Packard) 功能描述:Agilent ACPM-7891 Tri-Band Power Amplifier Module EGSM, DCS and PCS Multi-slot GPRS
ACPM-7891-BLK 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Agilent ACPM-7891 Tri-Band Power Amplifier Module EGSM, DCS and PCS Multi-slot GPRS
ACPM-7891-TR1 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Agilent ACPM-7891 Tri-Band Power Amplifier Module EGSM, DCS and PCS Multi-slot GPRS