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參數(shù)資料
| 型號(hào)： | ACAC0612 |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | Flat Chip Resistor Array |
| 中文描述： | 扁平芯片電阻陣列 |
| 文件頁數(shù)： | 4/5頁 |
| 文件大?。?/td> | 369K |
| 代理商： | ACAC0612 |
ACAC 0612 - Precision
Vishay Beyschlag
Flat Chip Resistor Array
www.vishay.com
4
For technical questions contact: ff3aresistors@vishay.com
Document Number: 28741
Revision: 28-Nov-05
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
EN 140 000 / EN 60 115-1, Generic specification
(includes tests)
EN 140 400 / EN 60 115-1, Sectional specification
(includes schedule for qualification approval)
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60 068
and under standard atmospheric conditions according to
IEC 60 068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1 060 mbar).
The components are mounted for testing on boards in
accordance with EN 60 115-1, 4.31 unless otherwise
specified.
In the following table only the tests and requirements are
listed with reference to the relevant clauses of EN 60 115-1
and IEC 60 068-2; a short description of the test procedure
is also given.
Note
1.
2.
Figures are given for equal values.
For a single element.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
1)
PERMISSIBLE CHANGE
(
R/R)
stability for product types:
ACAC 0612
100
to 221 k
4.5
resistance
± 0.25 %
4.8.4.2
temperature coefficient
at 20 / LCT / 20
°
C and
20 / UCT / 20
°
C
×
± 25 ppm/K
4.25.1
endurance
U =
or U = U
max
;
1.5 h on; 0.5 h off;
70
°
C; 1000 h
± (0.25 % R + 0.05
)
4.25.3
endurance at upper
category temperature
125
°
C; 1000 h
± (0.5 % R + 0.05
)
4.24
78 (Cab)
damp heat,
steady state
(40 ±
2)
°
C; 56 days;
(93 ± 3) % RH
±
(0.5 % R + 0.05
)
4.13
short time overload
2)
U = 2.5
×
U = 2
×
U
max
; 5 s
or
± (0.1 % R + 0.01
)
no visible damage
4.19
14 (Na)
rapid change of
temperature
30 min. at LCT and
30 min. at UCT; 5 cycles
±
(0.1 % R + 0.01
)
no visible damage
4.18.2
58 (Tb)
resistance to soldering
heat
reflow method 2 (IR / forced gas
convention); (260 ±
5)
°
C;
(10 ± 1) s
solder bath method;
(215 ± 3)
°
C;
(3 ±
0.3) s
± (0.1 % R + 0.01
)
no visible damage
4.17.2
58 (Ta)
solderability
good tinning (
≥
95 % covered);
no visible damage
4.32
21 (Ue
3
)
shear (adhesion)
RR 1632M; 45 N
no visible damage
4.7
voltage proof
U
rms
= U
ins
;
60 ±
5 s; against ambient,
between adjacent resistors
no flashover or breakdown
P
70
R
P
70
R
×
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